AMD XCVC1702-1LSENSVG1369

Product attributes

Attribute value

Manufacturer:

AMD

Series:

Versal™ AI Core

Package/Case:

1369-BFBGA, FCBGA

Packaging:

Tray

Product Status:

Active

Architecture:

MPU, FPGA

Core Processor:

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size:

-

RAM Size:

-

Peripherals:

DDR, DMA, PCIe

Connectivity:

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

400MHz, 1GHz

Primary Attributes:

Versal™ AI Core FPGA, 1M Logic Cells

Operating Temperature:

0°C ~ 100°C (TJ)

Grade:

-

Qualification:

-

Supplier Device Package:

1369-FCBGA (35x35)