Rochester Electronics, LLC UDS2981R/B

UDS2981R/B is identified by Rochester Electronics as a high-voltage, high-current source driver in the Analog & Mixed Signal category. It is intended for designs that require logic-controlled sourcing of current to external loads.

The exact Rochester record specifies CDIP18 with 18 pins. Treat the ceramic DIP outline, lead spacing, seating plane, and orientation mark as controlled mechanical requirements.

Layout checks

• Verify the 18-pin through-hole footprint and row spacing.
• Confirm pin-1 orientation before assembly.
• Allow clearance appropriate to the ceramic body and socket, if used.
• Review thermal rise for the actual load duty cycle.

The expected local CDIP18 JPG is currently missing; this draft must remain under review until the package image and registry entry are verified.

The device combines logic-control inputs, source-driver outputs, and supply connections in an 18-pin package.

Use the controlled pin assignment for UDS2981R/B before schematic capture; do not infer channel-to-pin mapping from this functional summary.

Electrical limits are intentionally omitted where the exact controlled datasheet values were not available in the verified product record.

No drop-in alternate is asserted. Any candidate must be checked for source-versus-sink topology, channel count, pinout, load-supply range, output-current capability, input thresholds, protection behavior, package dimensions, temperature grade, and compliance status.

Rochester Electronics lists UDS2981R/B as a Rochester Active product. Qualification records should retain the complete ordering code and verify traceability, date code, package marking, and applicable documentation for the received lot.

Match the received part marking and package to UDS2981R/B, preserve lot traceability, and verify that non-RoHS/non-lead-free handling is compatible with the assembly process.

This page is an engineering selection aid, not a replacement for controlled manufacturer documentation. Verify electrical limits, timing, pin assignment, mechanical dimensions, qualification level, and assembly compatibility before release.