Hello! now
tms@lcdchip.com
NXP USA Inc. PCA2003U/10AC/1Z
- Part No.:
- PCA2003U/10AC/1Z
- Manufacturer:
- NXP USA Inc.
- Category:
- Specialized ICs
- Package:
- Die
- Description:
- IC WATCH CIRCUIT DIE
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
Product Details
PCA2003U/10AC/1Z - Programmable 32 kHz Watch Circuit
NXP PCA2003U/10AC/1Z is an eight-pad wire-bond die for quartz-controlled watch timing and adaptive bipolar stepping-motor drive, supplied as die in tape reel.
The exact ordering code, die form, carrier and technical values follow the NXP PCA2003 product data sheet, Rev. 5. Verify OTP configuration and die-assembly conditions for the application.
Overview
The PCA2003 combines a 32 kHz quartz oscillator, programmable timing adjustment, motor-step detection and adaptive pulse modulation. Its bipolar motor outputs can adapt drive energy to the mechanical load.
Key Advantages
Adaptive motor drive
Step detection and selectable drive levels respond to the torque required by the mechanism.
Time adjustment
One-time-programmable timing calibration supports watch assembly adjustment.
Low-current timing
Supply current between motor pulses is 90 nA typical under the reference data-sheet conditions.
Die-in-reel supply
The exact /1Z option uses a tape-reel die carrier for an appropriate assembly flow.
Feature Summary
Quartz oscillator
Amplitude-regulated 32 kHz quartz-crystal timing with programmable digital correction.
Motor outputs
Two outputs drive a bipolar stepping motor with monitored-step correction.
OTP settings
Pulse width, output period, duty cycle and drive-stage count are selectable through OTP memory.
RESET function
A dedicated pad supports stopping the motor for setting and accelerated testing.
Package & Footprint
Package: NXP PCA200xU wire-bond die with eight bonding pads. Nominal die dimensions are 1.16 × 0.86 × 0.20 mm. The exact PCA2003U/10AC/1Z ordering option is delivered as die in tape reel.
- Use NXP's bare-die outline and bonding-pad coordinates for the bond diagram.
- The substrate is tied to VSS; the die pad must be floating or connected to VSS.
- Leave the internally connected factory-test pad open in normal use.
A standard molded-package JPG is not applicable to this manufacturer-confirmed bare die. Verify carrier orientation, die handling and bonding processes separately.
Pin Functions
These are numbered bonding pads, not package leads.
Validate exact pad coordinates against the NXP die drawing before bond-wire design.
Key Specifications
| Device function | Programmable 32 kHz watch circuit with adaptive bipolar motor drive |
|---|---|
| Exact orderable form | PCA2003U/10AC/1Z, wire-bond die in tape reel |
| Bonding pads | 8 |
| Nominal die size | 1.16 × 0.86 × 0.20 mm |
| Orderable option temperature | −10 to +60 °C ambient |
| Operating supply | 1.1 to 3.6 V over −10 to +60 °C ambient |
| Reference crystal | 32.768 kHz |
| Current between motor pulses | 90 nA typical, 120 nA maximum at VDD = 1.55 V and Tamb = 25 °C reference conditions |
| Programmable pulse width | 0.98 to 7.8 ms according to OTP setting |
| Motor drive stages | 3 to 6, including the highest stage |
| Selectable output periods | 1, 5, 10, 20 or 30 s |
| OTP organization | Four 8-bit words for calibration, motor settings and type recognition |
The electrical values above depend on the data-sheet test setup and OTP configuration; verify the motor, quartz crystal and supply conditions in the final design.
Replacement Considerations
NXP also lists PCA2003U/10AC/1,00 as the same PCA2003U/10AC/1 die type delivered on sawn wafer and film-frame carrier, rather than a tape reel. Any sourcing substitution needs confirmation of die handling, orientation, OTP programming and assembly compatibility. PCA2000, PCA2001 and PCA2002 variants are not unconditional substitutes because functions or timing options differ. No drop-in equivalence is claimed.
Manufacturer Information
The product record identifies NXP USA Inc. NXP's PCA2003 product data sheet, Rev. 5 (1 May 2019), explicitly lists PCA2003U/10AC/1Z, its bare-die package and tape-reel delivery. Consult current manufacturer-controlled documentation for lifecycle and design changes.
Applications
Battery-operated wristwatches
Quartz-based timekeeping and bipolar stepping-motor drive.
Wire-bond watch modules
Compact motor-control assemblies designed for tape-reel die handling and OTP calibration.
Quality & Authenticity
Confirm the full orderable code, die marking, carrier format, traceability and physical condition against procurement records. Apply NXP bare-die handling and ESD precautions. This description is not a certification of any particular lot.
FAQ
Is PCA2003U/10AC/1Z a packaged eight-pin IC?
No. NXP specifies an eight-bonding-pad wire-bond die supplied on tape reel.
What must be checked before assembly?
Validate pad coordinates, substrate and test-pad treatment, carrier orientation and die-bond process.
Is the film-frame option identical for manufacturing?
It uses the same PCA2003U/10AC/1 die type, but its carrier differs; assembly and programming compatibility still require review.
Engineering Notice
Use the NXP data sheet and die outline as the design authority. Validate quartz loading, motor characteristics, OTP settings, bonding, substrate connection and ambient limits before production release.
PCA2003U/10AC/1Z Information
- Specifications
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- NXP USA Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- Watch Circuit
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
- Grade:
- -
- Qualification:
- -
- Include Parts
- Popular Search
The following parts include "PCA2003U/10AC/1Z" in Silicon Labs PCA2003U/10AC/1Z.
- Part Number
- Manufacturer
- Package
- Description
- CAP200DG-TL Power Integrations 8-SOIC (0.154", 3.90mm Width) IC AUTOMATIC DISCHARGE 8SO
- ATSHA204A-MAHDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATSHA204A-SSHDA-T Microchip Technology 8-SOIC (0.154", 3.90mm Width) IC AUTHENTICATION CHIP 8SOIC
- ATSHA204A-STUCZ-T Microchip Technology TO-236-3, SC-59, SOT-23-3 IC AUTHENTICATION CHIP SOT23-3
- ATECC608B-MAHDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-MAHCZ-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-SSHDA-T Microchip Technology 8-SOIC (0.154", 3.90mm Width) IC AUTHENTICATION CHIP 8SOIC
- ATECC608B-MAHDA-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608A-MAHDA-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-MAVDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
The following parts are popular search parts in Test and Measurement.
Inventory:4,807
Please send an inquiry. Send us your inquiry, and we will respond immediately.
