Hello! now
tms@lcdchip.com
NXP USA Inc. PCA2003U/10AC/1,00
- Part No.:
- PCA2003U/10AC/1,00
- Manufacturer:
- NXP USA Inc.
- Category:
- Specialized ICs
- Package:
- Die
- Description:
- IC WATCH CIRCUIT WAFER
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
Product Details
PCA2003U/10AC/1,00 - 32 kHz Watch Motor-Drive Circuit
NXP PCA2003U/10AC/1,00 is a programmable 32 kHz watch circuit with adaptive bipolar stepping-motor drive, supplied as an eight-bonding-pad wire-bond die.
Technical details below follow the NXP PCA2003 product data sheet, Rev. 5. Confirm the programmed OTP settings and bare-die assembly requirements for the intended design.
Overview
The PCA2003 combines a 32 kHz crystal oscillator, programmable time adjustment, step detection and adaptive pulse modulation for a bipolar stepping motor. A successful motor step is monitored so the drive can adapt to the torque required by the watch mechanism.
Key Advantages
Adaptive drive
Step detection and selectable drive stages adjust motor energy to the load.
Programmable timing
OTP settings support digital time calibration and selectable output periods.
Low-current operation
The specified current between motor pulses is 90 nA typical under the data-sheet reference conditions.
Bare-die integration
Eight bonding pads support direct integration where a wire-bond die is required.
Feature Summary
Oscillator
Amplitude-regulated 32 kHz quartz-crystal oscillator with programmable digital frequency adjustment.
Motor control
Bipolar motor outputs MOT1 and MOT2 with monitored steps and correction pulses.
Pulse configuration
Selectable pulse width, modulation duty cycle, three to six drive stages and output period through OTP memory.
Stop and test
RESET pad supports stopping the motor for time setting and accelerated test functions.
Package & Footprint
Manufacturer package: PCA200xU wire-bond die with eight bonding pads. Nominal bare-die dimensions are 1.16 × 0.86 × 0.20 mm. The orderable /10AC/1,00 option is delivered as sawn wafer on film-frame carrier.
- Use the NXP bare-die outline and bonding-pad coordinates for the bond diagram.
- The substrate is connected to VSS; keep the die pad floating or connect it to VSS as the data sheet specifies.
- Pad 2 is internally connected for factory test and should be left open in normal operation.
A conventional package JPG is not applicable to this manufacturer-confirmed bare die. Verify die handling, carrier format and assembly process separately.
Pin Functions
The eight numbered connections are bonding pads, not molded-package leads.
Confirm pad coordinates and bond-wire clearances against the NXP die-outline drawing before assembly.
Key Specifications
| Function | Programmable 32 kHz watch circuit with adaptive bipolar motor drive |
|---|---|
| Exact orderable form | PCA2003U/10AC/1,00; wire-bond die on sawn wafer / film-frame carrier |
| Bonding pads | 8 |
| Nominal die dimensions | 1.16 × 0.86 × 0.20 mm |
| Ambient temperature for orderable option | −10 to +60 °C |
| Operating supply range | 1.1 to 3.6 V at −10 to +60 °C |
| Reference oscillator frequency | 32.768 kHz quartz crystal |
| Supply current between motor pulses | 90 nA typical, 120 nA maximum at VDD = 1.55 V and Tamb = 25 °C reference conditions |
| Programmable motor-pulse width | 0.98 to 7.8 ms, according to OTP code |
| Selectable drive stages | 3 to 6, including the highest stage |
| Selectable output period | 1, 5, 10, 20 or 30 s, according to OTP settings |
| OTP organization | Four 8-bit words for calibration, motor drive and type recognition |
Electrical values and limits are conditional on the NXP data-sheet test setup; verify crystal, motor load and programmed OTP values for the end application.
Replacement Considerations
NXP also documents PCA2003U/10AC/1Z, which uses the same PCA2003U/10AC/1 die type but a different carrier format (die in tape reel). It is a sourcing or assembly option only after checking carrier handling, OTP programming, die revision and bonding requirements. PCA2000, PCA2001 and PCA2002 family members are not unconditional substitutes; their functions or timing options differ. No cross-reference is asserted as a drop-in replacement.
Manufacturer Information
The product record identifies NXP USA Inc. NXP's PCA2003 product data sheet, Rev. 5 (1 May 2019), explicitly lists the complete PCA2003U/10AC/1,00 ordering code and its wire-bond die delivery form. Check the current manufacturer-controlled documentation and lifecycle status for new designs.
Applications
Battery-operated watches
32 kHz timekeeping and motor drive for a bipolar stepping-motor mechanism.
Miniature motor-control assemblies
Adaptive pulse drive where bare-die bonding and programming are supported.
Quality & Authenticity
Confirm the complete ordering code, die marking, carrier, traceability and condition against purchase documentation. Follow NXP bare-die handling guidance and verify assembly and ESD controls before use. This description does not certify the condition or provenance of any specific lot.
FAQ
Is this an eight-pin molded IC?
No. The manufacturer specifies a wire-bond die with eight bonding pads.
Does it require programming?
OTP settings define time calibration and motor-drive behavior; verify the programmed state for the watch design.
Can the /1Z ordering option be used instead?
It uses a different carrier format. Confirm assembly, programming and supply-chain requirements before substitution.
Engineering Notice
Use the manufacturer's controlled data sheet and bare-die outline as the design authority. Validate crystal parameters, motor load, OTP configuration, pad bonding, substrate connection, operating limits and lot-specific handling before releasing an assembly.
PCA2003U/10AC/1,00 Information
- Specifications
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- NXP USA Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- Watch Circuit
- Applications:
- Wrist Watches
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
- Grade:
- -
- Qualification:
- -
- Include Parts
- Popular Search
The following parts include "PCA2003U/10AC/1,00" in Silicon Labs PCA2003U/10AC/1,00.
- Part Number
- Manufacturer
- Package
- Description
- CAP200DG-TL Power Integrations 8-SOIC (0.154", 3.90mm Width) IC AUTOMATIC DISCHARGE 8SO
- ATSHA204A-MAHDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATSHA204A-SSHDA-T Microchip Technology 8-SOIC (0.154", 3.90mm Width) IC AUTHENTICATION CHIP 8SOIC
- ATSHA204A-STUCZ-T Microchip Technology TO-236-3, SC-59, SOT-23-3 IC AUTHENTICATION CHIP SOT23-3
- ATECC608B-MAHDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-MAHCZ-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-SSHDA-T Microchip Technology 8-SOIC (0.154", 3.90mm Width) IC AUTHENTICATION CHIP 8SOIC
- ATECC608B-MAHDA-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608A-MAHDA-S Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
- ATECC608B-MAVDA-T Microchip Technology 8-UFDFN Exposed Pad IC AUTHENTICATION CHIP 8UDFN
The following parts are popular search parts in Test and Measurement.
Inventory:2,199
Please send an inquiry. Send us your inquiry, and we will respond immediately.
