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NXP PCA2001U/10AC/1,00 is an eight-pad wire-bond die for 32 kHz quartz watch timing and adaptive bipolar stepping-motor drive, delivered as sawn wafer on film-frame carrier.
Technical information follows the NXP PCA2000/PCA2001 data sheet, Rev. 9. The exact ordering code is included in NXP's product and lifecycle records; verify current lifecycle and OTP programming before design use.
The PCA2001 integrates a 32 kHz crystal oscillator, programmable time adjustment, motor-step detection and adaptive pulse drive. It is designed for battery-operated watch mechanisms using a bipolar stepping motor. Unlike PCA2000, the PCA2001 does not provide the battery End-of-Life (EOL) indication function.
Motor-step detection adjusts drive level to the torque demand of the mechanism.
OTP-stored time adjustment supports watch-level accuracy trimming.
Supply current between motor pulses is 90 nA typical under the stated reference test conditions.
Eight bonding pads permit a wire-bond assembly designed for this bare-die form.
Amplitude-regulated 32 kHz oscillator with electrically programmable time calibration.
One-second bipolar motor pulses with step detection and correction behavior.
Motor pulse width, modulation and adaptation range are stored in OTP memory.
RESET pad provides motor stop for time setting and accelerated functional testing.
Manufacturer form: PCA200xU wire-bond die with eight bonding pads; nominal die dimensions 1.16 × 0.86 × 0.20 mm. NXP lists PCA2001U/10AC/1 as sawn wafer on a film-frame carrier, and its controlled product record lists the exact /10AC/1,00 orderable variant.
A standard package JPG does not apply to the manufacturer-confirmed bare die. Verify film-frame handling and ESD controls for the assembly line.
The following numbers identify bonding pads, not molded-package leads.
Confirm the pad orientation and coordinates against the manufacturer die drawing before assembly.
| Function | 32 kHz watch timing with adaptive bipolar motor drive |
|---|---|
| Manufacturer die type | PCA2001U/10AC/1; exact orderable code PCA2001U/10AC/1,00 |
| Package form | Wire-bond die; sawn wafer on film-frame carrier |
| Bonding pads | 8 |
| Nominal die dimensions | 1.16 × 0.86 × 0.20 mm |
| Ambient range | −10 to +60 °C |
| Normal operating supply | 1.1 to 3.6 V over −10 to +60 °C |
| Reference oscillator | 32.768 kHz quartz crystal |
| Current between motor pulses | 90 nA typical, 120 nA maximum at VDD = 1.55 V and Tamb = 25 °C reference conditions |
| Motor pulse period | One second in normal operation |
| Programmable motor-pulse width | 0.98 to 7.8 ms according to OTP setting |
| Battery EOL indication | Not provided by PCA2001; this feature is specific to PCA2000 |
Typical and limiting values must be interpreted with the data-sheet test conditions, quartz network and programmed OTP state.
The PCA2000 shares the watch-drive family but adds a battery End-of-Life indication function, so it is not an unconditional replacement. PCA2003 adds programmable output-period options and also requires functional review. Any candidate must be checked for bare-die pad geometry, carrier, OTP configuration, timing, voltage range, lifecycle and assembly flow; no drop-in equivalence is asserted.
The product record identifies NXP USA Inc. NXP's PCA2000/PCA2001 product data sheet, Rev. 9 (24 November 2011), controls the circuit and die information. NXP's exact ordering and discontinuation records identify PCA2001U/10AC/1,00 as End of Life; verify current supply eligibility before design-in.
32 kHz quartz timing with bipolar stepping-motor drive.
Bare-die assemblies with post-assembly time calibration and appropriate motor matching.
Check the complete orderable code, marking, carrier, traceability and die condition against purchasing records. Follow NXP handling and ESD guidance. This description does not certify any individual lot or ongoing manufacturer availability.
No. The exact option is an eight-pad wire-bond die on a sawn-wafer film-frame carrier.
No. NXP specifies that function for PCA2000, not PCA2001.
NXP lists the exact orderable code as End of Life. Confirm lifecycle and sourcing before selecting it.
Use manufacturer-controlled documentation for final design decisions. Validate quartz loading, motor torque, programmed timing, bond-pad layout, substrate connection and lifecycle status before releasing a product.
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