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NXP USA Inc. MCZ33905CS3EK

Part No.:
MCZ33905CS3EK
Manufacturer:
NXP USA Inc.
Category:
Specialized ICs
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Description:
IC INTERFACE SPECIALIZED 32SOIC
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Product Details

MCZ33905CS3EK - 3.3 V CAN and LIN System Basis Chip

MCZ33905CS3EK is an NXP 33905S-family system basis chip for automotive microcontroller power management, high-speed CAN and one LIN interface. The exact legacy order code uses a 32-pin exposed-pad SOIC-class package, recorded in the LCDChip catalog as 32-SSOP Exposed Pad.

NXP's current family data sheet lists the newer D-version order code and records removal of the C-version from the current orderable table. Verify the legacy C-version lifecycle and package drawing for the exact stock being purchased.

Overview

The 33905S combines a microcontroller supply regulator, high-speed CAN transceiver, single LIN transceiver, watchdog, wake-up resources and fail-safe functions in one automotive system basis chip. The CS3EK code denotes the C-version, 3.3 V VDD option and 32-pin exposed package. It is intended to consolidate essential power and communication functions around a vehicle control microcontroller.

Do not transfer a newer D-version reference design without reviewing C-versus-D revision notes, pinout, software configuration and safety requirements for the target ECU.

Key Advantages

Integrated vehicle networking

Combines high-speed CAN with one LIN interface in the 33905S configuration.

MCU power support

Provides the 3.3 V VDD version for a compatible microcontroller power rail.

Low-power modes

The family supports controlled reduced-power operation and wake-up monitoring.

Fail-safe supervision

Watchdog, reset, interrupt and SAFE-related functions support a validated system safety concept.

Feature Summary

Single LIN channel

The S variant includes one LIN interface; it is not the dual-LIN 33905D version.

Configurable wake resources

Manufacturer ordering information describes three wake-up inputs with one LIN master termination, or four wake-up inputs without that termination.

Serial control

SPI signals configure device operation and report diagnostic status to the host MCU.

Exposed-pad package

The 32-pin SOIC-class exposed package provides the grounding and thermal interface defined by the NXP footprint.

Package & Footprint

LCDChip's original record describes 32-SSOP (0.295 inch, 7.50 mm width) Exposed Pad, normalized by the package workbook to 32-SSOP Exposed Pad. DigiKey identifies the supplier package as 32-SOIC-EP, while NXP identifies the 33905S package as a 32-pin exposed SOIC, SOT1746-3 in its current family table. These naming layers require a drawing-level footprint check for the exact legacy CS3EK device.

Registered 32-SSOP Exposed Pad package illustration for MCZ33905CS3EK
32-SSOP Exposed Pad
Mechanical checks
  • Confirm the NXP drawing and land pattern for the exact device.
  • Check exposed-pad grounding and thermal layout.
  • Verify pin-one orientation and the difference between catalog case and supplier package names.

The registered JPG is currently missing locally. Add and inspect the image before publication.

Pin Functions

The named signals below follow NXP's 33905S 32-pin connection diagram and family pin-definition table. Use the manufacturer's numbered top-view drawing for PCB placement.

VSUP1, VSUP2, VDD and grounds

Battery-related supply inputs, regulated MCU supply output and package/lead-frame return connections.

CANH, CANL, TXD and RXD

High-speed CAN bus pair and microcontroller transmit/receive logic signals.

LIN, TXD-L, RXD-L and LIN-T/I/O-2

Single LIN bus connection, host logic interface and configurable LIN termination/wake input.

MOSI, MISO, SCLK and CS

SPI command/data interface used to configure and diagnose the system basis chip.

RST, INT, SAFE and DBG

Reset, interrupt, fail-safe and debug-related system-control signals.

VSENSE, MUX-OUT, I/O and auxiliary pins

Sense, multiplexed monitoring and configurable wake/general-purpose connections as defined in the NXP pin table.

Some pin functions are multiplexed or mode-dependent. Confirm register configuration and the exact numbered pin assignment before wiring.

Key Specifications

Device familyNXP 33905S system basis chip, legacy C-version
MCU supply option3.3 V VDD option in the CS3EK order code
CAN interfaceOne integrated high-speed CAN transceiver
LIN interfacesOne integrated LIN interface in the S configuration
Wake/termination optionsThree wake inputs plus one LIN master termination, or four wake inputs without LIN termination, per family ordering table
Control interfaceSPI with MOSI, MISO, SCLK and CS signals
Operating ambient rating-40 to +125 degrees C, NXP MC33905 orderable-family table
LIN supply range7.0 to 18 V VSUP, LIN characteristics conditions; not the absolute maximum
LIN VBAT operating range8.0 to 18 V in the documented LIN characteristics table
Package32-pin exposed-pad SOIC-class; verify exact CS3EK drawing against catalog 32-SSOP Exposed Pad name
LifecycleC-version removed from current NXP orderable table; distributor lists exact part obsolete

The LIN electrical-characteristics conditions are not a universal operating-voltage specification for every integrated block. Apply the full data-sheet limits, thermal derating and external-component rules to the final design.

Replacement Considerations

NXP's current family table recommends the 33905 D-version for new designs and states that the C and D versions have no electrical-parameter specification changes, but the D version includes quality improvements. MCZ33905DS3EK exists in the LCDChip catalog as a distinct unpublished product. It still requires confirmation of order-code packaging, qualification, software behavior and customer approval; no automatic drop-in claim is made.

MCZ33905CS5EK and MCZ33904C3EK also exist as distinct unpublished LCDChip models. The former has a 5.0 V rather than 3.3 V VDD option; the latter belongs to a different family configuration. Neither is a direct replacement without MCU rail, CAN/LIN, wake-input, pinout and safety analysis. No internal links are inserted to these unpublished entries.

Manufacturer Information

NXP Semiconductors maintains the MC33903/MC33904/MC33905 family data sheet and an exact MCZ33905CS3EK product record. The current data-sheet revision removes legacy C-version order codes from its ordering table and directs new designs toward the D revision. Procurement of this obsolete exact model should include date-code, authenticity and lifecycle checks.

Applications

Automotive CAN/LIN ECU

Provide MCU power and network interfaces in a qualified vehicle control module.

Gateway and body control

Combine communication, wake-up monitoring and diagnostics around a host controller.

Low-power vehicle nodes

Use documented low-power modes and wake events in a validated battery budget.

Legacy system maintenance

Source exact C-version stock for an already qualified design while checking traceability.

Quality & Authenticity

Verify the complete MCZ33905CS3EK marking, exposed-pad package, tube packaging, date code and manufacturer traceability. Obsolete or last-stock devices need heightened authenticity review. Match the actual package and electrical revision to the previously approved ECU bill of materials; an illustrative JPG is not sufficient proof.

FAQ

How many LIN channels does this part provide?

The 33905S configuration provides one LIN interface alongside high-speed CAN.

Is its MCU rail 3.3 V or 5 V?

The CS3EK order code denotes the 3.3 V VDD option. Verify the host MCU's full power requirements against the data sheet.

Can MCZ33905DS3EK be substituted automatically?

No. NXP recommends the D version for new designs, but the complete design, qualification and purchase order must be reviewed.

Is the catalog package image available?

No. The registered 32-SSOP Exposed Pad JPG is missing and its footprint mapping requires visual verification.

Engineering Notice

Use NXP's current family data sheet, package drawing, errata and product-change notices for engineering sign-off. Check the legacy C-version against the D-version before any redesign. Distributor stock and tier prices must be confirmed from a fresh exact-part quote before synchronization; the registered package JPG is missing, so this product must remain unpublished pending review.

MCZ33905CS3EK Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
NXP USA Inc.
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
-
Type:
-
Applications:
System Basis Chip
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOIC-EP
Grade:
-
Qualification:
-
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