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NXP Semiconductors MCZ33903DP3EK

Part No.:
MCZ33903DP3EK
Manufacturer:
NXP Semiconductors
Category:
Specialized ICs
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Description:
MCZ33903DP3EK - System Basis Chi
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Product Details

MCZ33903DP3EK - 3.3 V CAN System Basis Chip

NXP Semiconductors MCZ33903DP3EK integrates a high-speed CAN interface, MCU supply regulation, wake-up management, and SPI-controlled system functions in a 32-SSOP exposed-pad package.

The exact order code and package designation were checked against NXP-controlled product and package information. Verify the final design against the current NXP datasheet and ordering documentation.

Overview

MCZ33903DP3EK is the 3.3 V MC33903P variant in NXP's second-generation system basis chip family. It combines the functions commonly needed around an automotive microcontroller: battery-supplied power management, an enhanced high-speed CAN physical interface, wake-up inputs, reset and interrupt signaling, and a serial configuration interface. NXP's orderable-part table identifies the P version as a no-LIN configuration with three wake-up inputs; do not assume features of the S or D LIN variants are present.

Design the supply, CAN termination, exposed-pad grounding, watchdog/reset behavior, and wake-up configuration from the device-specific NXP tables and typical application schematic. The device is not a complete CAN controller; it requires an appropriate host MCU.

Key Advantages

Integrated node support

Combines MCU supply, high-speed CAN transceiver, monitoring, and system control functions.

3.3 V MCU rail

The DP3EK orderable variant is specified with a 3.3 V VDD output.

Wake-up flexibility

The P variant offers three wake-up inputs for system-state control.

Serial configuration

SPI access lets the host configure and monitor system basis functions.

Feature Summary

CAN physical layer

Integrated enhanced high-speed CAN bus interface with CANH, CANL, TXD, and RXD connections.

Power management

Battery-supply input, regulated VDD output, reset, and fail-safe support for the host system.

System supervision

Interrupt and diagnostic functions are controlled and observed through the MCU interface.

Variant boundary

MC33903P is a no-LIN variant; LIN functions shown for other family members must not be copied into this design.

Package & Footprint

The catalog package is 32-SSOP Exposed Pad. NXP identifies the exact part with package version SOT1762-2 (SSOP32). The package drawing describes a 32-terminal, 0.65 mm-pitch body approximately 11 mm by 7.5 mm by 2.3 mm. Use the controlled drawing and recommended land pattern for board layout; the exposed ground lead frame needs the specified thermal and electrical connection.

32-SSOP exposed-pad package reference for MCZ33903DP3EK
32-SSOP Exposed Pad
Layout checks
  • Match SOT1762-2 terminal numbering and exposed-pad geometry.
  • Check pad soldering and ground-return recommendations in the NXP package drawing.
  • Keep CAN bus routing, protection, and termination consistent with the system schematic.

Package image pending: the registered JPG is absent locally and the production image URL currently returns HTTP 404. This draft must not be published until the actual image is available and verified.

Pin Functions

The following groups summarize functions shown for the MC33903P in the NXP pin-connection and pin-definition sections. Use the NXP pin-number table, not this summary, when assigning schematic nets.

VSUP and VDD

Battery-related supply input and regulated MCU supply output.

CANH, CANL, TXD, RXD

High-speed CAN bus pair and MCU transmit/receive interface.

CS, SCLK, MOSI, MISO

Four-wire SPI chip select, clock, data input, and data output.

RST, INT, SAFE

Host reset, interrupt, and safety-related signaling.

I/O-0, I/O-2, I/O-3

Configurable input/output and wake-up resources of the P variant.

GND and exposed lead frame

Ground references and exposed package connection.

The exact pin numbers, no-connect treatment, and operating-mode functions must be verified from the MC33903P drawing and Table 4 of the current datasheet.

Key Specifications

Orderable modelMCZ33903DP3EK
ManufacturerNXP Semiconductors
Device familyMC33903 second-generation system basis chip
VariantMC33903P, no LIN interface
VDD output option3.3 V nominal orderable variant
CAN functionEnhanced high-speed CAN physical interface
Wake-up input optionThree wake-up inputs for the P variant
Host configurationSPI
Ambient rating in orderable table-40 °C to +125 °C
Package versionSOT1762-2 / 32-SSOP exposed-pad catalog designation
Package terminal pitch0.65 mm per NXP package drawing

Electrical thresholds, regulator load limits, CAN timing, and typical currents vary by operating mode and test conditions; consult the applicable NXP electrical-characteristics tables before component selection.

Replacement Considerations

NXP lists other MC33903 orderable variants, but they are not unconditional replacements. A 5.0 V VDD variant changes the MCU supply, while S and D variants add LIN functions and can change pin usage and system behavior. Compare the complete suffix, package version, exposed-pad footprint, power rails, CAN behavior, SPI configuration, temperature range, and required safety behavior before any substitution. No internal catalog replacement link is asserted here because an exact candidate catalog match and compatibility assessment have not been completed.

Manufacturer Information

NXP Semiconductors documents MCZ33903DP3EK in its MC33903/MC33904/MC33905 family documentation and exact-part product-content declaration. Refer to the current controlled datasheet, package drawing, and any applicable product-change notices when qualifying this order code.

Applications

Automotive CAN nodes

MCU-based modules needing power supervision and a high-speed CAN physical connection.

Body electronics

Distributed control nodes with wake-up inputs and low-power state control.

Industrial CAN equipment

Systems that can meet the device's electrical, EMC, and qualification requirements.

Quality & Authenticity

Confirm the complete NXP order code, top marking, package version, and traceability documents during incoming inspection. A catalog listing alone does not establish automotive qualification, application fitness, or authorized-channel provenance. Check the current manufacturer documentation and project-specific quality requirements before approval.

FAQ

Does MCZ33903DP3EK include LIN?

No. NXP's MC33903P orderable-part table specifies zero LIN interfaces for this variant.

What MCU rail is associated with DP3EK?

The orderable-part table identifies a 3.3 V VDD output option. Confirm load and voltage limits in the electrical tables for the intended operating mode.

Can another MC33903 suffix be substituted automatically?

No. Check supply voltage, LIN content, pin use, package, control settings, and qualification for the complete order code.

Is the package image verified?

No. The production package JPG is currently unavailable, so publication is blocked pending image verification.

Engineering Notice

Use this page as a selection summary, not as a substitute for the latest NXP datasheet, package drawing, or application validation. Confirm the full order code, actual silicon revision, electrical limits, thermal path, EMC behavior, and CAN system design. The missing production package image prevents publication of this draft.

MCZ33903DP3EK Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Type:
-
Applications:
System Basis Chip
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOIC-EP
Grade:
Automotive
Qualification:
-
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