Microchip Technology HCS515T/SL

The HCS515 receives compatible encoded data at RF_IN, validates code words and communicates with a host controller through S_DAT and S_CLK. It supports normal and secure learning, retains learned transmitter information in internal EEPROM and may be used stand-alone or with a microcontroller.

The registered package is 14-SOIC. Microchip's SL designation specifies a 14-lead plastic SOIC with a 150 mil body; the catalog lists 0.154 in (3.90 mm) body width. T identifies tape-and-reel supply, not a different electrical function.

Layout checks

• Use a 14-lead narrow-body SOIC land pattern, not a DIP footprint.
• Verify pin-1 orientation and mechanical dimensions against Microchip's current drawing.
• Confirm the assembly process accepts the specified tape-and-reel ordering format.

The expected 14-SOIC JPG is missing locally and requires verification before publication.

Microchip data sheet DS40183E shows the following 14-pin HCS515 signal assignments for PDIP and SOIC packages.

Review the manufacturer's full pin descriptions and timing requirements before completing the receiver schematic.

Protocol figures describe required encoder configuration; they do not guarantee compatibility with an arbitrary transmitter. Use the manufacturer timing tables for circuit sign-off.

Other HCS515 order codes require careful comparison. HCS515/P has a through-hole DIP package and cannot use the /SL SOIC footprint. Industrial-temperature versions need a matching complete ordering code and qualification. For another KEELOQ decoder or MCU-based receiver, verify cryptographic-key management, learning mode, PWM timing, synchronization, host interface, pinout, supply and mechanical fit. No unverified part is represented as a drop-in replacement.

Microchip Technology documents the HCS515 family in data sheet DS40183E, revision E. Its product-identification system defines T as tape and reel, SL as a 14-lead 150 mil plastic SOIC and the commercial/industrial temperature designations. Verify final marking and packaging against the complete order code.

Inspect the full manufacturer marking, lead condition, 14-lead narrow SOIC body and packaging traceability. Validate transmitter learning and decoding with the intended receiver hardware and provisioned keys before production release.

Confirm current Microchip electrical limits, code-word compatibility, provisioning procedures, board footprint and application security requirements. This description does not replace the manufacturer's data sheet or receiver-level qualification. The package image remains pending.