Microchip Technology HCS515/P

The HCS515 accepts a compatible encoded signal at RF_IN, checks the received code word and provides decoded status to a host through its synchronous serial interface. It stores learned transmitter information internally and supports normal and secure learning. It can operate as a stand-alone decoder or alongside a microcontroller.

HCS515/P uses the registered 14-DIP through-hole package. Microchip defines P as a 14-lead plastic DIP with a 300 mil body; the catalog records 0.300 in (7.62 mm).

Layout checks

• Use a 14-position, 300 mil through-hole footprint.
• Check pin-1 orientation and board clearance against the Microchip drawing.
• Do not substitute the 14-lead SOIC footprint for the /P variant.

The expected 14-DIP JPG is not present in the local package image directory; the image must be verified and added before publication.

The 14-lead PDIP and SOIC pin assignments in Microchip data sheet DS40183E share the following signal positions.

Check the full electrical pin descriptions and required external connections in the manufacturer data sheet; do not use NC pins as circuit nodes.

Protocol compatibility figures are manufacturer-stated conditions, not guaranteed interoperability with every encoder configuration. Review DS40183E for timing limits and test conditions.

HCS515-I/P is an industrial-temperature ordering variant, but its temperature grade and complete order code must be checked against the application. HCS515/SL uses a 14-lead SOIC package and is not footprint-compatible with the /P DIP. Other KEELOQ decoders or microcontroller implementations require a review of learned-key handling, modulation, synchronization behavior, host protocol, supply, pinout and package. No unverified device is presented as a drop-in replacement.

Microchip Technology documents HCS515 in data sheet DS40183E, revision E. Its product-identification table defines the /P plastic DIP and the commercial and industrial temperature suffixes. Match the marking and full ordering code to the required package and grade.

For incoming inspection, compare the complete part marking, 14-lead DIP body, lead condition and traceability records with the purchase specification. Confirm firmware and provisioning compatibility in the actual receiver before production qualification.

Use the current Microchip data sheet and a receiver-level test to verify electrical limits, code-word compatibility, key provisioning, synchronization behavior and security requirements. This description does not replace a formal design review. The package image is pending and must not be treated as a verified mechanical drawing.