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The Analog Devices / Maxim Integrated DS34S104GN+ is a four-port TDM-over-packet processor for transporting circuit services over packet networks. The manufacturer's ordering table specifies a 256-ball TECSBGA package and an operating-temperature range of -40°C to +85°C. The LCDChip record uses the generic package name 256-BGA.
The manufacturer marks this product not recommended for new designs. Confirm suitability, package drawing, and support status before design-in.
DS34S104 is the four-port member of the DS34S101/102/104/108 family. It maps TDM services into packet-network streams and reconstructs them at the receiving side. The family supports E1/T1 serial streams and one E3/T3/STS-1 stream, with configurable bundles, packet encapsulation, clock recovery, and host management. Select the exact port configuration and operating mode using the manufacturer's data sheet, not a generic family description.
Concentrates four circuit interfaces in the DS34S104 variant.
Supports SAToP, CESoPSN, TDMoIP/AAL1, and HDLC-based modes described for the family.
Adaptive, common, external, and loopback recovery options address different network timing architectures.
Combines a 10/100 Ethernet MAC with parallel and SPI host-control options.
E1/T1 serial channels, with the documented higher-rate E3/T3/STS-1 mode.
Up to 64 configurable bundles in the manufacturer's family architecture.
IPv4/IPv6, UDP/RTP, L2TPv3, MPLS, and Metro Ethernet options as configured.
SDRAM interface supports packet-buffer management.
The original LCDChip API record names 256-BGA. The manufacturer's exact DS34S104GN+ ordering row says 256 TECSBGA. The package registry maps the generic 256-BGA name to /upload/package/256-BGA.jpg, but that JPG is absent locally and returns HTTP 404 on the production site. The missing generic image cannot establish ball pitch, body size, land pattern, or mechanical interchangeability; use the manufacturer's package drawing and ball map before layout.

The data sheet groups package balls by function; signal names below are not ball-location assignments. Check the manufacturer's 256-ball map for coordinates and multiplexing.
Transmit-side TDM clock input and transmit-data output.
Receive-side TDM clock and data inputs.
Recovered clock output for the respective TDM interface.
Ethernet MAC transmit and receive data signals.
Ethernet management clock and data.
External SDRAM clock, data, and address groups.
System, common-reference, and high-frequency clock groups.
System reset and separate core/I/O supply domains.
| Exact ordering code | DS34S104GN+ |
|---|---|
| Function | Four-port TDM-over-packet processor |
| Operating-temperature range | -40°C to +85°C, manufacturer ordering table |
| Manufacturer package | 256-ball TECSBGA |
| LCDChip package record | 256-BGA (generic registry label) |
| TDM modes | E1/T1 serial; documented E3/T3/STS-1 mode |
| Packet modes | SAToP, CESoPSN, TDMoIP/AAL1, HDLC |
| Ethernet interface | 10/100 MAC; MII/RMII/SSMII options |
| Host access | 16-/32-bit parallel or SPI options |
| Supply domains | 1.8 V core and 3.3 V I/O, per data-sheet requirements |
| Product lifecycle | Not recommended for new designs, manufacturer product page |
Configure operating modes and electrical limits from the manufacturer's tables; family capabilities are not all simultaneous operating modes.
No drop-in substitute is established. DS34S101 and DS34S102 are one- and two-port family members; DS34S108 is an eight-port member with a different package option. A candidate must be compared for port count, service encapsulation, clock recovery, Ethernet/SDRAM/host interfaces, supply domains, software configuration, and the exact 256 TECSBGA ball map. No unverified internal alternative is linked.
Analog Devices publishes the legacy Maxim Integrated DS34S101-DS34S108 data sheet and the DS34S104 product page. The product page identifies DS34S104 as not recommended for new designs. Consult the latest controlled documentation and manufacturer support for availability and design-in decisions.
Carry TDM services across a suitably engineered packet network.
Aggregate four TDM interfaces in a managed gateway architecture.
Apply the appropriate recovery method for the packet network's timing design.
Evaluate exact-code replacement against a qualified legacy board and firmware.
Verify the exact DS34S104GN+ marking, traceability, 256-ball package geometry, and environmental suffix against manufacturer documentation. Review the package drawing and device revision before acceptance. A generic or missing package JPG is not an authenticity test.
The manufacturer's exact ordering table lists four ports.
No. It is the LCDChip generic record; the manufacturer specifies 256 TECSBGA for this ordering code.
The manufacturer marks DS34S104 not recommended for new designs; discuss alternatives and support with the manufacturer.
No. The registered production JPG currently returns HTTP 404, so this detail remains under review.
Before board release, validate packet mode, jitter and timing budget, clock recovery, SDRAM and Ethernet interfaces, supply sequencing, and the exact package ball map from the Analog Devices data sheet. The production package image is missing. Do not publish this draft until the image is available and the rendered page and all validation gates pass.
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