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Analog Devices Inc./Maxim Integrated DS34S104GN+

Part No.:
DS34S104GN+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Specialized ICs
Package:
256-BGA
Description:
IC TIME DIV MULTIPLX 256CSBGA
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Product Details

DS34S104GN+ - Four-Port TDM-over-Packet Device

The Analog Devices / Maxim Integrated DS34S104GN+ is a four-port TDM-over-packet processor for transporting circuit services over packet networks. The manufacturer's ordering table specifies a 256-ball TECSBGA package and an operating-temperature range of -40°C to +85°C. The LCDChip record uses the generic package name 256-BGA.

The manufacturer marks this product not recommended for new designs. Confirm suitability, package drawing, and support status before design-in.

Overview

DS34S104 is the four-port member of the DS34S101/102/104/108 family. It maps TDM services into packet-network streams and reconstructs them at the receiving side. The family supports E1/T1 serial streams and one E3/T3/STS-1 stream, with configurable bundles, packet encapsulation, clock recovery, and host management. Select the exact port configuration and operating mode using the manufacturer's data sheet, not a generic family description.

This ordering code is listed as DS34S104GN+ in the manufacturer table: four ports, 256 TECSBGA, -40°C to +85°C. The plus suffix denotes the manufacturer's lead-free/RoHS ordering option.

Key Advantages

Four TDM ports

Concentrates four circuit interfaces in the DS34S104 variant.

Flexible packet transport

Supports SAToP, CESoPSN, TDMoIP/AAL1, and HDLC-based modes described for the family.

Clock options

Adaptive, common, external, and loopback recovery options address different network timing architectures.

Host and Ethernet interfaces

Combines a 10/100 Ethernet MAC with parallel and SPI host-control options.

Feature Summary

Service mapping

E1/T1 serial channels, with the documented higher-rate E3/T3/STS-1 mode.

Bundle capacity

Up to 64 configurable bundles in the manufacturer's family architecture.

Network formats

IPv4/IPv6, UDP/RTP, L2TPv3, MPLS, and Metro Ethernet options as configured.

External memory

SDRAM interface supports packet-buffer management.

Package & Footprint

The original LCDChip API record names 256-BGA. The manufacturer's exact DS34S104GN+ ordering row says 256 TECSBGA. The package registry maps the generic 256-BGA name to /upload/package/256-BGA.jpg, but that JPG is absent locally and returns HTTP 404 on the production site. The missing generic image cannot establish ball pitch, body size, land pattern, or mechanical interchangeability; use the manufacturer's package drawing and ball map before layout.

Registered 256-BGA package illustration for DS34S104GN+
Registered 256-BGA image (currently unavailable)
Layout checks
  • Verify the 256-ball TECSBGA outline and ball-A1 orientation.
  • Use the manufacturer's ball map for power, TDM, Ethernet, SDRAM, and host buses.
  • Review 1.8 V core and 3.3 V I/O supply domains.

Pin Functions

The data sheet groups package balls by function; signal names below are not ball-location assignments. Check the manufacturer's 256-ball map for coordinates and multiplexing.

TDMn_TCLK / TDMn_TX

Transmit-side TDM clock input and transmit-data output.

TDMn_RCLK / TDMn_RX

Receive-side TDM clock and data inputs.

TDMn_ACLK

Recovered clock output for the respective TDM interface.

MII_TXD[3:0] / MII_RXD[3:0]

Ethernet MAC transmit and receive data signals.

MDC / MDIO

Ethernet management clock and data.

SD_CLK / SD_D[31:0] / SD_A[11:0]

External SDRAM clock, data, and address groups.

CLK_SYS / CLK_CMN / CLK_HIGH

System, common-reference, and high-frequency clock groups.

RST_SYS_N / DVDDC / DVDDIO

System reset and separate core/I/O supply domains.

Key Specifications

Exact ordering codeDS34S104GN+
FunctionFour-port TDM-over-packet processor
Operating-temperature range-40°C to +85°C, manufacturer ordering table
Manufacturer package256-ball TECSBGA
LCDChip package record256-BGA (generic registry label)
TDM modesE1/T1 serial; documented E3/T3/STS-1 mode
Packet modesSAToP, CESoPSN, TDMoIP/AAL1, HDLC
Ethernet interface10/100 MAC; MII/RMII/SSMII options
Host access16-/32-bit parallel or SPI options
Supply domains1.8 V core and 3.3 V I/O, per data-sheet requirements
Product lifecycleNot recommended for new designs, manufacturer product page

Configure operating modes and electrical limits from the manufacturer's tables; family capabilities are not all simultaneous operating modes.

Replacement Considerations

No drop-in substitute is established. DS34S101 and DS34S102 are one- and two-port family members; DS34S108 is an eight-port member with a different package option. A candidate must be compared for port count, service encapsulation, clock recovery, Ethernet/SDRAM/host interfaces, supply domains, software configuration, and the exact 256 TECSBGA ball map. No unverified internal alternative is linked.

Manufacturer Information

Analog Devices publishes the legacy Maxim Integrated DS34S101-DS34S108 data sheet and the DS34S104 product page. The product page identifies DS34S104 as not recommended for new designs. Consult the latest controlled documentation and manufacturer support for availability and design-in decisions.

Applications

Legacy circuit transport

Carry TDM services across a suitably engineered packet network.

Access-network equipment

Aggregate four TDM interfaces in a managed gateway architecture.

Clock-aware service delivery

Apply the appropriate recovery method for the packet network's timing design.

Existing-platform maintenance

Evaluate exact-code replacement against a qualified legacy board and firmware.

Quality & Authenticity

Verify the exact DS34S104GN+ marking, traceability, 256-ball package geometry, and environmental suffix against manufacturer documentation. Review the package drawing and device revision before acceptance. A generic or missing package JPG is not an authenticity test.

FAQ

How many TDM ports does DS34S104GN+ provide?

The manufacturer's exact ordering table lists four ports.

Is 256-BGA the exact manufacturer package name?

No. It is the LCDChip generic record; the manufacturer specifies 256 TECSBGA for this ordering code.

Is it suitable for a new design?

The manufacturer marks DS34S104 not recommended for new designs; discuss alternatives and support with the manufacturer.

Is the package JPG currently available?

No. The registered production JPG currently returns HTTP 404, so this detail remains under review.

Engineering Notice

Before board release, validate packet mode, jitter and timing budget, clock recovery, SDRAM and Ethernet interfaces, supply sequencing, and the exact package ball map from the Analog Devices data sheet. The production package image is missing. Do not publish this draft until the image is available and the rendered page and all validation gates pass.

DS34S104GN+ Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Type:
TDM (Time Division Multiplexing)
Applications:
Data Transport
Mounting Type:
Surface Mount
Supplier Device Package:
256-CSBGA (17x17)
Grade:
-
Qualification:
-
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