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The Maxim Integrated DS3184, documented by Analog Devices, combines four ATM-cell/HDLC-packet PHY channels, DS3/E3 framing and four line interface units (LIUs). It connects supported digital transport traffic to DS3, E3 or STS-1 physical copper interfaces.
The unsuffixed DS3184 is specified for 0°C to +70°C in a 400-ball thermally enhanced PBGA. Confirm device revision and errata before a board-level replacement.
Each DS3184 port combines cell/packet processing, a DS3/E3 framer/formatter and an analog line interface unit. The device maps and demaps ATM cells or HDLC packets between a selectable system-side interface and as many as four copper lines. Ports are independently configurable for supported framing and traffic modes, enabling mixed-service equipment designs.
Four independently configurable transport ports serve higher-density DS3/E3 systems.
Integrated LIUs provide receive clock/data recovery and transmit waveshaping.
ATM/packet mapping and DS3/E3 framing reduce separate functional devices.
UTOPIA and POS-PHY mode options connect to compatible host processing hardware.
Maps and demaps ATM cells or HDLC packets on the documented per-port modes.
Four LIUs interface with supported physical copper line modes using external analog network components.
The manufacturer describes a jitter attenuator configurable in the receive or transmit path.
Integrated clock-rate adaptation supports the documented DS3, E3 and clear-channel operating modes.
Maxim's ordering table specifies a 400-ball TE-PBGA, 27 mm × 27 mm, with 1.27 mm pitch for DS3184. LCDChip records 400-BBGA; the established package register maps that catalog name to 400-BBGA.jpg. Verify the manufacturer's ball map, thermal-ground connections and exact assembly drawing instead of treating the generic catalog name as a footprint specification.

The registered JPG is absent locally and returns HTTP 404 on the production site. It must be restored and checked before publication.
These signal groups summarize the manufacturer architecture, not a ball-level pinout. The exact 400-ball table governs routing and multiplexed functions.
Per-port analog transmit and receive connections route through the specified transformer and termination circuits.
UTOPIA/POS-PHY data, control and clock functions depend on the configured operating mode.
Address, data, selection, read/write and interrupt signals configure ports and report status.
Supply, ground, reference clock and IEEE 1149.1 signals require the full manufacturer pin map.
| Exact model | DS3184 |
|---|---|
| Manufacturer lineage | Maxim Integrated; documentation hosted by Analog Devices |
| Function | Quad ATM/packet PHY with DS3/E3 framers and integrated LIUs |
| Ports | Four, independently configurable |
| Supported line families | DS3, E3 and STS-1 physical copper modes |
| Traffic | ATM cells and HDLC packets |
| System-side interfaces | UTOPIA L2/L3, POS-PHY L2/L3 or SPI-3 modes |
| Bus widths | 8, 16 or 32 bits, mode-dependent |
| Operating temperature | 0°C to +70°C for unsuffixed DS3184 |
| Manufacturer package | 400-ball TE-PBGA, 27 × 27 mm, 1.27 mm pitch |
| Catalog package | 400-BBGA |
Use the Rev. 3 data sheet and device errata for electrical ratings, transformer choices, line-side performance, clocking and detailed timing.
DS3181, DS3182 and DS3183 are one-, two- and three-port family members. Family pin compatibility does not guarantee that a lower-port device will serve a four-port board. DS3164 is a related four-port PHY/framer without the same built-in LIU arrangement, so it is not a direct functional replacement. Compare analog line circuitry, enabled ports, bus configuration, firmware register map, clocks, pin assignments and revision-specific errata. The DS3184N has a different temperature range.
No internal alternative-product link is asserted without an exact LCDChip API match and engineering verification.
Analog Devices hosts Maxim's DS3181–DS3184 Rev. 3 family data sheet and the DS3184 product page. The documentation identifies the exact quad-port function, integrated LIUs, ordering temperature, TE-PBGA package and related errata. Use the manufacturer's line-interface layout guidance for any new or repaired PCB.
High-density transport interfaces with multiple DS3/E3 lines.
Framed cell and packet traffic on copper transport links.
Multiport telecom uplinks using supported system-side buses.
DS3/E3/STS-1 physical-interface evaluation and maintenance.
Check the exact DS3184 marking rather than DS3184N or another family member, plus lot traceability, package condition, revision and moisture-sensitive handling. Validate line-side behavior and the board's installed configuration. A missing catalog image does not authenticate the device or demonstrate mechanical fit.
Four independently configurable PHY/framer/LIU paths.
Yes. The DS3184 family data sheet identifies built-in LIUs.
400-ball thermally enhanced PBGA, 27 mm square with 1.27 mm pitch.
No. N denotes the -40°C to +85°C option; validate the full design before substitution.
Validate the 75-ohm copper-line network, transformers, transmit waveshaping, receive recovery, jitter/clock configuration, bus timing, four-port firmware and TE-PBGA thermal-ground scheme against the complete data sheet and revision errata. Restore and verify the production 400-BBGA JPG before publication.
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