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DS3163 is a Maxim Integrated triple-port ATM/packet physical-layer device for DS3, E3 and STS-1-class digital transport designs. The catalog lists a 400-BBGA package; the manufacturer specifies a 400-lead TE-PBGA.
Confirm the exact order code, board footprint and system interface before replacement or new design use.
The DS3163 belongs to the DS3161/DS3162/DS3163/DS3164 family of one-, two-, three- and four-port ATM/packet PHYs. Its three independently configurable ports map and demap ATM cells or HDLC packets over framed DS3, framed E3 or clear-channel digital streams. The device is a digital PHY/framer, not an analog line interface; verify the companion LIU and system clock architecture separately.
Manufacturer documentation lists DS3 M23/C-bit and E3 G.751/G.832 framing, direct and clear-channel mapping, UTOPIA level 2/3 and POS-PHY level 2/3 or SPI-3 interfaces, and per-port configuration. Functional modes and clock limits depend on interface selection; consult the full register and timing sections before enabling a mode.
The catalog's 400-BBGA registration maps to `/upload/package/400-BBGA.jpg`. The manufacturer's DS3163 ordering table identifies a 400-lead TE-PBGA, 27 mm × 27 mm with 1.27 mm pitch. The generic registered image is absent locally and is not a substitute for the exact manufacturer ball map or mechanical drawing.

The DS3163 pin-assignment matrix in the manufacturer's data sheet identifies separate transmit and receive data/control signals for each port, system-interface buses, processor-control signals, reference clocks, JTAG, VDD and VSS balls. Signal direction and alternate functions depend on mode. Use the DS3163-specific matrix and register descriptions for net-by-net design; do not copy the DS3164 or DS3162 ball map.
| Exact order code | DS3163 |
|---|---|
| Manufacturer | Maxim Integrated; documentation maintained by Analog Devices |
| Function | Triple ATM/packet PHY and DS3/E3 framer |
| Port count | Three independently configurable ports |
| Transport | DS3, E3 and clear-channel modes up to 52 Mbps per manufacturer description |
| Cell/packet interface | UTOPIA L2/L3 or POS-PHY L2/L3 or SPI-3 |
| Level 3 clock | Up to 66 MHz for UTOPIA/POS-PHY L3, subject to mode and timing limits |
| Level 2 clock | Up to 52 MHz for UTOPIA/POS-PHY L2, subject to mode and timing limits |
| Supply | 3.3 V nominal VDD; use data-sheet operating limits |
| Temperature order grade | DS3163: 0 °C to +70 °C in manufacturer ordering table |
| Manufacturer package | 400-lead TE-PBGA, 27 mm × 27 mm, 1.27 mm pitch |
The catalog package label is 400-BBGA. Confirm ball map, operating conditions and mode-specific timing in the controlled data sheet.
DS3161, DS3162 and DS3164 provide different port counts within the family, but a replacement requires confirmation of ball mapping, firmware register programming, clocking, enabled protocols, package and temperature grade. No in-stock internal alternative is asserted here because no exact candidate was validated through the product lookup API. Do not assume drop-in interchangeability.
Analog Devices hosts the Maxim Integrated DS3161–DS3164 Rev. 3 data sheet and DS3163 product information. The source defines the triple-port function, ordering grade, package, ball map and electrical characteristics. Validate the shipped part markings and document revision for a specific lot.
Suitable system contexts described by the manufacturer include access concentrators, digital cross-connects, multiservice access platforms, routers and switches, PDH multiplexer/demultiplexer equipment and telecom test equipment. System compliance depends on the complete line-interface and clock design.
Match the full DS3163 marking and lot documentation to the manufacturer ordering table. Verify package integrity, moisture-handling requirements, traceability and test records before installation. The catalog record alone does not certify a particular shipment.
Three independently configurable digital PHY/framer ports.
No. Verify the companion line-interface device and line-side circuit.
The manufacturer lists a 400-lead TE-PBGA, 27 mm × 27 mm with 1.27 mm pitch.
No. The registered 400-BBGA JPG is missing.
Do not release this page for public indexing until the registered package JPG is present and the generic catalog label has been reconciled with the DS3163-specific TE-PBGA ball map. Confirm exact lot, temperature grade, clock configuration and companion LIU before a board substitution.
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