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Analog Devices Inc./Maxim Integrated DS3163

Part No.:
DS3163
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Specialized ICs
Package:
400-BBGA
Description:
IC PHY TRANSCEIVER 400PBGA
Quantity:

Unit Price:$0

Ext Price:$0

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Product Details

DS3163 - Triple DS3/E3 ATM and Packet PHY

DS3163 is a Maxim Integrated triple-port ATM/packet physical-layer device for DS3, E3 and STS-1-class digital transport designs. The catalog lists a 400-BBGA package; the manufacturer specifies a 400-lead TE-PBGA.

Confirm the exact order code, board footprint and system interface before replacement or new design use.

Overview

The DS3163 belongs to the DS3161/DS3162/DS3163/DS3164 family of one-, two-, three- and four-port ATM/packet PHYs. Its three independently configurable ports map and demap ATM cells or HDLC packets over framed DS3, framed E3 or clear-channel digital streams. The device is a digital PHY/framer, not an analog line interface; verify the companion LIU and system clock architecture separately.

Key Advantages

  • Three ports can be configured independently for the required transport format.
  • Integrated framing and cell/packet processing reduce external digital logic.
  • Family pin compatibility supports port-density migration after board-level validation.
  • Supports UTOPIA and POS-PHY bus integration options.

Feature Summary

Manufacturer documentation lists DS3 M23/C-bit and E3 G.751/G.832 framing, direct and clear-channel mapping, UTOPIA level 2/3 and POS-PHY level 2/3 or SPI-3 interfaces, and per-port configuration. Functional modes and clock limits depend on interface selection; consult the full register and timing sections before enabling a mode.

Package & Footprint

The catalog's 400-BBGA registration maps to `/upload/package/400-BBGA.jpg`. The manufacturer's DS3163 ordering table identifies a 400-lead TE-PBGA, 27 mm × 27 mm with 1.27 mm pitch. The generic registered image is absent locally and is not a substitute for the exact manufacturer ball map or mechanical drawing.

400-BBGA package artwork pending
Package artwork pending
Footprint checks
  • Compare the DS3163-specific 400-ball assignment.
  • Check center ground-ball connections and thermal layout.
  • Validate 27 mm body size, 1.27 mm pitch and board reflow process.

Pin Functions

The DS3163 pin-assignment matrix in the manufacturer's data sheet identifies separate transmit and receive data/control signals for each port, system-interface buses, processor-control signals, reference clocks, JTAG, VDD and VSS balls. Signal direction and alternate functions depend on mode. Use the DS3163-specific matrix and register descriptions for net-by-net design; do not copy the DS3164 or DS3162 ball map.

Key Specifications

Exact order codeDS3163
ManufacturerMaxim Integrated; documentation maintained by Analog Devices
FunctionTriple ATM/packet PHY and DS3/E3 framer
Port countThree independently configurable ports
TransportDS3, E3 and clear-channel modes up to 52 Mbps per manufacturer description
Cell/packet interfaceUTOPIA L2/L3 or POS-PHY L2/L3 or SPI-3
Level 3 clockUp to 66 MHz for UTOPIA/POS-PHY L3, subject to mode and timing limits
Level 2 clockUp to 52 MHz for UTOPIA/POS-PHY L2, subject to mode and timing limits
Supply3.3 V nominal VDD; use data-sheet operating limits
Temperature order gradeDS3163: 0 °C to +70 °C in manufacturer ordering table
Manufacturer package400-lead TE-PBGA, 27 mm × 27 mm, 1.27 mm pitch

The catalog package label is 400-BBGA. Confirm ball map, operating conditions and mode-specific timing in the controlled data sheet.

Replacement Considerations

DS3161, DS3162 and DS3164 provide different port counts within the family, but a replacement requires confirmation of ball mapping, firmware register programming, clocking, enabled protocols, package and temperature grade. No in-stock internal alternative is asserted here because no exact candidate was validated through the product lookup API. Do not assume drop-in interchangeability.

Manufacturer Information

Analog Devices hosts the Maxim Integrated DS3161–DS3164 Rev. 3 data sheet and DS3163 product information. The source defines the triple-port function, ordering grade, package, ball map and electrical characteristics. Validate the shipped part markings and document revision for a specific lot.

Applications

Suitable system contexts described by the manufacturer include access concentrators, digital cross-connects, multiservice access platforms, routers and switches, PDH multiplexer/demultiplexer equipment and telecom test equipment. System compliance depends on the complete line-interface and clock design.

Quality & Authenticity

Match the full DS3163 marking and lot documentation to the manufacturer ordering table. Verify package integrity, moisture-handling requirements, traceability and test records before installation. The catalog record alone does not certify a particular shipment.

FAQ

How many ports does DS3163 provide?

Three independently configurable digital PHY/framer ports.

Does it directly drive a DS3/E3 cable?

No. Verify the companion line-interface device and line-side circuit.

Which package is specified?

The manufacturer lists a 400-lead TE-PBGA, 27 mm × 27 mm with 1.27 mm pitch.

Is the package image available locally?

No. The registered 400-BBGA JPG is missing.

Engineering Notice

Do not release this page for public indexing until the registered package JPG is present and the generic catalog label has been reconciled with the DS3163-specific TE-PBGA ball map. Confirm exact lot, temperature grade, clock configuration and companion LIU before a board substitution.

DS3163 Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
400-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Type:
PHY Transceiver
Applications:
Testing Equipment
Mounting Type:
Surface Mount
Supplier Device Package:
400-PBGA (27x27)
Grade:
-
Qualification:
-
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