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DS28E39Q+T is an Analog Devices/Maxim DeepCover bidirectional authenticator using ECC-P256 ECDSA and ChipDNA physically unclonable-function protection. The exact Q+T order code is a six-pin exposed-pad TDFN supplied on tape and reel, rated -40°C to +85°C.
Security depends on controlled key provisioning, host validation, power delivery and the complete system trust model.
The DS28E39 combines a ChipDNA PUF, ECC-P256 cryptographic engine, true-random-number generator and protected EEPROM for challenge-response authentication over a 1-Wire connection. ChipDNA-derived material protects stored data and can, under user control, provide the ECDSA private key. A factory-programmed 64-bit ROM ID identifies the device on the bus. Authentication can be used in both host-to-device and device-to-host system flows.
ECC-P256 ECDSA supports challenge-response signatures without sharing a symmetric secret with every verifier.
ChipDNA PUF-derived material helps protect data against invasive extraction.
On-chip EEPROM accommodates application data, key material, control settings and certificates.
A factory-programmed 64-bit ROM ID acts as the device identity on a multidrop 1-Wire bus.
Derives device-specific key content from physical silicon variation.
Supports NIST P-256 signatures for public-key authentication.
An optional 17-bit, one-time-settable decrement-only counter supports authenticated reads.
Uses a single-contact open-drain bus with an external pullup and external capacitor for parasitic power.
LCDChip registers 6-WDFN Exposed Pad. Analog Devices' exact ordering row specifies DS28E39Q+T as a six-pin 3 mm × 3 mm TDFN-EP on tape and reel. The exposed paddle is soldered evenly to the board ground plane. Check the controlled footprint and pin-one orientation.

The expected local JPG is absent and the production URL returns HTTP 404. Keep this draft unpublished until the correct image is restored and inspected.
The manufacturer's DS28E39Q+ TDFN pin table assigns pins 1, 4 and 5 as no-connect; pin 2 as 1-Wire IO; pin 3 as ground; and pin 6 as CEXT, the external-capacitor input. Solder the exposed pad to the ground plane for proper operation. Design the IO pullup and CEXT network from the electrical table rather than treating the capacitor pin as a general-purpose I/O.
| Function | DeepCover bidirectional ECDSA secure authenticator |
|---|---|
| Exact order code | DS28E39Q+T |
| Package | Six-pin 3 mm × 3 mm TDFN-EP; tape and reel |
| Temperature range | -40°C to +85°C |
| 1-Wire pullup voltage | 2.97 V to 3.63 V |
| Pullup resistance | 1 kΩ maximum under the manufacturer's stated conditions |
| External capacitor | 470 nF nominal; data-sheet system range 399.5 nF to 540.5 nF |
| Public-key engine | ECC-P256 ECDSA |
| Physical key technology | ChipDNA PUF |
| EEPROM array | 2 Kbits shared among user data, keys, control and certificate storage |
| Optional counter | 17-bit decrement-only, one-time settable |
| Factory ROM ID | Unique 64 bits |
| Interface | Open-drain, single-contact 1-Wire |
Bus-speed descriptions differ within the public document; confirm timing against the controlled current revision and host implementation before design release.
Other ECDSA authenticators can differ in PUF behavior, key provisioning, certificate format, 1-Wire command set, EEPROM map, external-power requirements and footprint. Do not assume compatibility from ECC-P256 or a six-pin package alone. No unverified internal alternative is linked.
Analog Devices' DS28E39 DeepCover Secure ECDSA Bidirectional Authenticator with ChipDNA PUF Protection, public data sheet Rev. 0, supplies the exact Q+T ordering information, TDFN pin functions, electrical requirements and high-level security features. The separate Security User Guide is required for detailed commands.
Validate an attached accessory against the host security policy.
Bind sensor identity to a provisioned authentication flow.
Apply authenticated decrement-counter policy where suitable.
Use hardware-backed signatures in a device enrollment scheme.
Check package marking, traceability, TDFN geometry and unique ROM ID. Validate PUF-backed key behavior, host signature verification, protected-memory access and optional counter semantics. Test the 1-Wire power and timing network across the specified temperature range.
No. The device operates from the 1-Wire interface with an external capacitor at CEXT.
Pin 2 is IO on the six-pin TDFN-EP.
Yes. The Q package is the six-pin TDFN-EP and T is tape-and-reel supply.
The registered package JPG is absent from the production site.
Obtain controlled security-command documentation, confirm timing and strong-pullup requirements, review key/certificate provisioning, and verify the exposed-pad footprint. Restore and inspect the live package JPG before formal publication.
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