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Analog Devices / Maxim Integrated DS28E30X+U is a four-bump wafer-level 1-Wire secure authenticator based on an ECC P-256 hardware engine and ECDSA challenge-response authentication. LCDChip records its package as 4-XFBGA, WLBGA; Analog Devices identifies the X ordering option as WLCSP/WLP.
Confirm the exact X+U ordering code, four-bump drawing, and current security documentation before use.
DS28E30 provides asymmetric authentication for compatible hosts over a single-contact 1-Wire bus. A preprogrammed, write-protected ECC P-256 key pair, ECDSA signature engine, true random number generator, secured EEPROM, unique 64-bit ROM ID, and authenticated decrement-only counter support identity and usage-control applications. The X+U ordering model is listed by Analog Devices as a WLCSP option, corresponding to the manufacturer's four-bump WLP pin configuration.
ECDSA with a protected P-256 key pair supports challenge-response verification.
A unique 64-bit ROM ID identifies the part on a 1-Wire network.
The 1-Wire interface minimizes signal connections between the host and secure peripheral.
The four-bump X option supports space-constrained assemblies when the controlled land pattern is used.
ECC P-256, ECDSA signatures, SHA-256 support, and a true random number generator.
3 Kb of secured EEPROM total, including 1 Kb user memory and protected key, certificate, counter, and control regions.
One-time-settable 17-bit nonvolatile decrement-only counter with authenticated read.
Overdrive-speed communication with parasite-power support using external capacitors.
The site product record specifies 4-XFBGA, WLBGA, and the package registry maps that record to the name 4-XFBGA. Analog Devices lists DS28E30X+U as WLCSP; the Rev. 3 data sheet shows a four-bump WLP. Treat these names as a documentation cross-check, not as proof that a generic 4-XFBGA land pattern is mechanically interchangeable. Obtain the exact manufacturer WLCSP dimensions and assembly drawing for the X+U option.

The registered package JPG is unavailable on the production website. Use the controlled Analog Devices package drawing; do not use a generic picture for assembly qualification.
The manufacturer's four-bump WLP pin-description table assigns:
1-Wire input/output and power-delivery connection.
Ground reference; connect directly to the ground plane.
Input for the external capacitor used in the parasite-power circuit.
Input for the second external capacitor used by the internal regulator.
The six-pin TSOC pinout is different and does not apply to DS28E30X+U.
| Device role | 1-Wire ECDSA secure authenticator |
|---|---|
| Asymmetric engine | ECC P-256 with ECDSA challenge-response |
| Key pair | Preprogrammed, write-protected P-256 private/public key pair |
| Randomness | Integrated true random number generator for secure nonces |
| Secured EEPROM | 3 Kb total; includes 1 Kb user-memory area |
| Usage counter | 17-bit, one-time-settable, nonvolatile decrement-only |
| ROM identity | Unique factory-programmed 64-bit ID |
| Bus interface | 1-Wire, overdrive speed |
| Operating range | 1.62 V to 5 V on the 1-Wire power source; -40°C to +85°C |
| Power support | Parasite supply using external CEXT1 and CEXT2 capacitors |
| Manufacturer package | Four-bump WLP / WLCSP X option; site record: 4-XFBGA, WLBGA |
Use the current data sheet's electrical test conditions, capacitor values, 1-Wire timing, and absolute ratings for engineering sign-off.
Any replacement must match ECDSA and certificate trust behavior, ROM and command protocol, protected-memory layout, counter semantics, 1-Wire voltage and timing, external-capacitor network, temperature range, and exact four-bump geometry. A six-pin TSOC option or a different secure authenticator is not an unconditional footprint or firmware replacement. No unverified LCDChip alternative-product link is asserted here.
Analog Devices lists DS28E30X+U on its DS28E30 product page as a WLCSP model. Refer to the current Rev. 3 data sheet, Security User Guide, exact package drawing, and manufacturer notices for controlled technical information and qualification.
Verify compatible replaceable peripherals using an asymmetric challenge-response design.
Authenticate battery packs and support controlled charge-cycle tracking.
Identify and authenticate tools or sensors under a validated host protocol.
Use the four-bump wafer-level option when the assembly process supports its exact land pattern.
Verify the complete DS28E30X+U code, wafer-level marking or lot traceability, packaging, bump integrity, and official manufacturer notices. A cryptographic authenticity check requires certificate validation, secure host behavior, and suitable handling of failed or replayed responses.
No. Its principal authentication scheme is ECDSA with ECC P-256. The device also includes SHA-256 support, which is not the same as the SHA-3 authenticator family.
No. Analog Devices lists the X option as WLCSP, and the data sheet shows four WLP bumps. The six-pin TSOC is a different package option.
The manufacturer's description identifies CEXT1 for parasite-power storage and CEXT2 for internal-regulator support. Follow its specified values and placement.
No. It is a one-time-settable decrement-only counter; consult the Security User Guide for authenticated-read and decrement commands.
Validate the exact WLCSP bump map and land pattern, CEXT1/CEXT2 capacitor values, 1-Wire power and strong-pullup timing, certificate trust chain, protected key handling, and firmware responses to authentication failures. The registered 4-XFBGA JPG currently returns 404 on the production site, and the site package naming must be reconciled with the manufacturer's WLCSP drawing before publication.
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