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Laird Technologies EMI BMI-C-007-01

Name: BMI-C-007-01
Brand: Laird Technologies EMI
SKU: BMI-C-007-01
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BMI-C-007-01

Manufacturer:: Laird Technologies EMI

Category:: RFI and EMI - Contacts, Fingerstock and Gaskets

Package:

Description:: RFI FINGERSTOCK BECU TIN SOLDER

Quantity:: Add To Cart Add To RFQ list

Unit Price:$0

Ext Price:$0

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BMI-C-007-01 Information

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Product attributes: Attribute value

Manufacturer:: Laird Technologies EMI

Series:: BMI-C

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Fingerstock

Shape:: -

Width:: 0.059" (1.50mm)

Length:: 0.130" (3.30mm)

Height:: 0.126" (3.20mm)

Material:: Beryllium Copper

Plating:: Tin

Plating - Thickness:: -

Attachment Method:: Solder

Operating Temperature:: -

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Part Number	BMI-C-004	BMI-C-007-01	BMI-C-006	BMI-C-001	BMI-C-002
Manufacturer	Laird Technologies EMI	Laird Technologies EMI	Laird Technologies EMI	Laird Technologies EMI	Laird Technologies EMI
Series	BMI-C	BMI-C	BMI-C	BMI-C	BMI-C
Packaging	Tape & Reel (TR)	Tape & Reel (TR)	Tape & Reel (TR)	Tape & Reel (TR)	Tape & Reel (TR)
Product Status	Active	Active	Active	Active	Active
Type	Fingerstock	Fingerstock	Fingerstock	Fingerstock	Fingerstock
Shape	-	-	-	-	-
Width	0.170" (4.32mm)	0.059" (1.50mm)	0.079" (2.00mm)	0.078" (2.00mm)	0.394" (10.00mm)
Length	0.235" (5.97mm)	0.130" (3.30mm)	0.113" (2.86mm)	0.122" (3.11mm)	0.085" (2.17mm)
Height	0.204" (5.17mm)	0.126" (3.20mm)	0.100" (2.54mm)	0.096" (2.44mm)	0.100" (2.54mm)
Material	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Plating	Gold	Tin	Tin	Gold	Gold
Plating - Thickness	-	-	-	-	-
Attachment Method	Solder	Solder	Solder	Solder	Solder
Operating Temperature	-	-	-	-	-