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Laird Technologies EMI BMI-C-002

Part No.:
BMI-C-002
Manufacturer:
Laird Technologies EMI
Category:
RFI and EMI - Contacts, Fingerstock and Gaskets
Package:
Description:
RFI FINGERSTOCK BECU GOLD SOLDER
Quantity:

Unit Price:$0

Ext Price:$0

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BMI-C-002 Information

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Product attributes
Attribute value
Manufacturer:
Laird Technologies EMI
Series:
BMI-C
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Fingerstock
Shape:
-
Width:
0.394" (10.00mm)
Length:
0.085" (2.17mm)
Height:
0.100" (2.54mm)
Material:
Beryllium Copper
Plating:
Gold
Plating - Thickness:
-
Attachment Method:
Solder
Operating Temperature:
-
Image BMI-C-004 BMI-C-007-01 BMI-C-006 BMI-C-001 BMI-C-002
Part Number BMI-C-004 BMI-C-007-01 BMI-C-006 BMI-C-001 BMI-C-002
Manufacturer Laird Technologies EMI Laird Technologies EMI Laird Technologies EMI Laird Technologies EMI Laird Technologies EMI
Series BMI-C BMI-C BMI-C BMI-C BMI-C
Packaging Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR)
Product Status Active Active Active Active Active
Type Fingerstock Fingerstock Fingerstock Fingerstock Fingerstock
Shape - - - - -
Width 0.170" (4.32mm) 0.059" (1.50mm) 0.079" (2.00mm) 0.078" (2.00mm) 0.394" (10.00mm)
Length 0.235" (5.97mm) 0.130" (3.30mm) 0.113" (2.86mm) 0.122" (3.11mm) 0.085" (2.17mm)
Height 0.204" (5.17mm) 0.126" (3.20mm) 0.100" (2.54mm) 0.096" (2.44mm) 0.100" (2.54mm)
Material Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Plating Gold Tin Tin Gold Gold
Plating - Thickness - - - - -
Attachment Method Solder Solder Solder Solder Solder
Operating Temperature - - - - -
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The following parts include "BMI-C-002" in Silicon Labs BMI-C-002.

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