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| Part Number | BMI-C-004 | BMI-C-007-01 | BMI-C-006 | BMI-C-001 | BMI-C-002 |
| Manufacturer | Laird Technologies EMI | Laird Technologies EMI | Laird Technologies EMI | Laird Technologies EMI | Laird Technologies EMI |
| Series | BMI-C | BMI-C | BMI-C | BMI-C | BMI-C |
| Packaging | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Product Status | Active | Active | Active | Active | Active |
| Type | Fingerstock | Fingerstock | Fingerstock | Fingerstock | Fingerstock |
| Shape | - | - | - | - | - |
| Width | 0.170" (4.32mm) | 0.059" (1.50mm) | 0.079" (2.00mm) | 0.078" (2.00mm) | 0.394" (10.00mm) |
| Length | 0.235" (5.97mm) | 0.130" (3.30mm) | 0.113" (2.86mm) | 0.122" (3.11mm) | 0.085" (2.17mm) |
| Height | 0.204" (5.17mm) | 0.126" (3.20mm) | 0.100" (2.54mm) | 0.096" (2.44mm) | 0.100" (2.54mm) |
| Material | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Plating | Gold | Tin | Tin | Gold | Gold |
| Plating - Thickness | - | - | - | - | - |
| Attachment Method | Solder | Solder | Solder | Solder | Solder |
| Operating Temperature | - | - | - | - | - |
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