Microchip Technology ATA663231-GBQW

The ATA663231 is a LIN system basis chip for vehicle slave nodes. It integrates the bus interface and an 85 mA, 3.3 V low-drop regulator. The exact -GBQW ordering example in Microchip's identification table specifies an eight-lead VDFN, tape-and-reel, RoHS-compliant package. The device supports normal, silent, fail-safe, and sleep operation.

• 5 to 28 V specified operating VS range; absolute supply capability up to 40 V is not a continuous operating recommendation.
• 3.3 V regulator output with ±2% nominal accuracy and 85 mA current capability.
• LIN 2.0/2.1/2.2/2.2A, ISO 17987-7, and SAE J2602-2 physical-layer compatibility listed by Microchip.
• LIN-bus wake-up, wake-source recognition, TXD timeout, undervoltage reset, short-circuit and thermal protection.
• AEC-Q100 qualification and wettable-flank VDFN package listed in the family data sheet.

The -GBQW code identifies an eight-lead VDFN. Microchip's Q8B drawing specifies a 3 × 3 mm body, 0.65 mm terminal pitch, and approximately 2.40 × 1.60 mm exposed pad. The exposed heat slug must connect to a wide ground plate on the PCB for heat dissipation. Match the exact land-pattern drawing and pin-1 index before release.

Typical currents are not guaranteed maxima; consult the electrical-characteristics tables for design limits.

A 5 V LIN SBC such as the ATA663254 is not a drop-in electrical substitute for a 3.3 V controller. Compare regulator output, current capability, LIN compatibility, mode control, reset behavior, thermal pad, package, and pin map. No internal alternative link is asserted without a verified catalog match.

Microchip DS20006075B identifies ATA663231 as the 3.3 V LIN-SBC family member and explicitly lists ATA663231-GBQW as the VDFN tape-and-reel ordering example. The same document provides operating modes, electrical characteristics, thermal guidance, and package/land drawings.

Verify the exact -GBQW marking, lot traceability, moisture handling, and 3.3 V regulator variant. Inspect wettable flanks and exposed-pad soldering; validate thermal performance at worst-case VS, load current, and ambient temperature.

Confirm LIN-bus transient protection, regulator dissipation, exposed-pad grounding, decoupling, reset timing, and mode transitions against DS20006075B. Publication is held until the registered package JPG is available and the rendered product page can be verified.