Unit Price:$0
Ext Price:$0



Alpha & Omega Semiconductor AOZ32034AQV integrates high-side and low-side N-channel MOSFETs with a half-bridge driver and adjustable slew-rate control. The exact device is supplied in a thermally enhanced 23-pin, 4 × 4 mm QFN package, represented in the LCDChip catalog as 23-PowerTFQFN.
Designed for wireless-charger transmitter power stages; verify coil, resonant tank, thermal design, and gate-drive timing in the complete system.
AOZ32034AQV is an integrated half-bridge power stage intended for wireless-charger transmitter coil drive. It combines N-channel power MOSFETs, a high/low-side driver, an integrated bootstrap diode, and a slew-rate control input. Designers can pair half-bridge stages in a full-bridge arrangement for a resonant transmitter, subject to the manufacturer's application circuit and thermal limits.
High-side and low-side MOSFETs and their driver are contained in one compact package.
The SRC connection adjusts drive behavior to balance switching losses and electromagnetic interference.
An integrated bootstrap diode simplifies the high-side supply circuit, with an external capacitor still required.
The datasheet identifies VCC undervoltage lockout and overtemperature protection.
The manufacturer positions the device as a 15–50 W coil-driver solution, contingent on complete system design.
Recommended VIN operation is 3.8–28 V, covering common 12 V and 24 V power rails.
Both integrated MOSFET paths have 7.5 mΩ typical on-resistance under the datasheet's stated test conditions.
The manufacturer's package is a thermally enhanced 23-pin 4 × 4 mm QFN.
The official AOZ32034AQV datasheet specifies a 23-pin 4 × 4 mm thermally enhanced QFN. The manufacturer's package page identifies QFN4x4B-23L / QFN4x4B_23L_EP2_S. LCDChip's existing normalized package is 23-PowerTFQFN. Confirm the exact land pattern and exposed-pad arrangement from the manufacturer drawing before board release; the normalized catalog label is not a mechanical specification.

The registered package JPG is awaiting upload on the production site.
Selected assignments from the manufacturer's 23-pin pin-description table:
Adjusts internal driver slew rate.
High-side and low-side PWM inputs.
Power input; connect all VIN pads together.
Half-bridge switching node; connect all VHB pads together.
Power-ground connections.
Bootstrap capacitor connection; capacitor goes to VHB.
Analog supply and analog ground.
No-connect pins; manufacturer note requires them to float.
Use the complete manufacturer pin diagram and recommended layout when placing the package.
| Device type | Integrated half-bridge MOSFET power stage and driver |
|---|---|
| Primary application | Wireless-charger transmitter coil drive |
| Recommended VIN | 3.8 to 28 V |
| Recommended VCC | 4.75 to 5.5 V |
| Ambient temperature | -40 to +125 °C |
| High-side MOSFET RDS(on) | 7.5 mΩ typical at VIN 12 V, VCC 5 V, bootstrap-to-switch voltage 5 V and switch current 1 A |
| Low-side MOSFET RDS(on) | 7.5 mΩ typical at VIN 12 V, VCC 5 V and switch current 1 A |
| Integrated protection | VCC undervoltage lockout and overtemperature protection |
| Bootstrap | Integrated diode; external capacitor between BST and VHB |
| Package | Thermally enhanced 23-pin 4 × 4 mm QFN |
| Output-power positioning | 15 to 50 W wireless-transmitter coil driver; system-dependent |
Typical electrical values apply only at their stated test conditions. Do not treat absolute-maximum stress limits as recommended operation.
No pin-compatible replacement is established here. Compare any proposed alternative against the exact 23-pin package drawing, integrated MOSFET resistance, power and control supplies, HIN/LIN logic and timing, slew-rate control, thermal design, and bootstrap connection. A related half-bridge device is not a drop-in substitute based solely on function or package size. No LCDChip internal replacement link is included without an exact API-confirmed product and manufacturer-supported relationship.
AOZ32034AQV is specified by Alpha & Omega Semiconductor. The manufacturer's AOZ32034AQV datasheet and QFN4x4B-23L package drawing control electrical and mechanical design decisions.
Drive a transmitter coil through a properly designed resonant power stage.
Pair two half-bridges when the complete design requires a full-bridge topology.
Use the integrated MOSFET/driver stage where footprint and switching behavior meet system requirements.
Adjust slew-rate control as part of an evaluated loss, thermal, and EMI tradeoff.
Verify the complete order code and traceability for received material. Inspect package marking against the manufacturer's marking documentation and confirm handling and reflow requirements through the approved quality process. This description does not imply a test result or authorized-distribution claim.
Yes. AOZ32034AQV integrates both N-channel MOSFETs and their half-bridge driver.
No. The manufacturer recommends VIN from 3.8 to 28 V and separately recommends VCC from 4.75 to 5.5 V.
Yes. The diode is integrated, while the datasheet directs an external capacitor between BST and VHB.
Validate electrical operating conditions, switching timing, thermal dissipation, EMI, and the exact QFN land pattern against the latest manufacturer documents. The catalog package image is not yet available online. This page does not state real-time inventory or pricing.
The following parts include "AOZ32034AQV" in Silicon Labs AOZ32034AQV.
The following parts are popular search parts in Test and Measurement.