Analog Devices Inc. AD8190ACPZ

The AD8190 is a two-input, one-output HDMI/DVI link switch. Four differential high-speed TMDS channels per link carry the video signals, while four auxiliary low-speed channels route DDC and other control lines. Input equalization and output pre-emphasis support longer cable paths in display and video-routing equipment.

ADI lists AD8190ACPZ as a 56-lead, 8 mm by 8 mm LFCSP with exposed pad. The original product database calls the package 56-VFQFN Exposed Pad, CSP; the local package registry includes 56-VFQFN Exposed Pad. Similar broad package labels are not proof that the registered image or land pattern matches the controlled ADI LFCSP drawing. Reconcile the manufacturer's outline and exposed-pad dimensions before use.

Layout checks

• Compare the 8 mm by 8 mm LFCSP body with the registered outline.
• Check pin-one orientation and all 56 contact positions.
• Confirm exposed-pad land, grounding and thermal guidance.

The registered package JPG is unavailable locally and returns 404 on the production site; its content has not been verified.

ADI's functional diagram and pin descriptions identify these groups:

Use the manufacturer's 56-lead pin map for exact pin numbers, supply partitioning and exposed-pad handling.

Signal-integrity and cable-length statements depend on cable, board layout, supply and equalization settings; use the datasheet test conditions.

Match the 56-lead LFCSP footprint, exposed pad, TMDS channel topology, auxiliary/DDC voltage behavior, I2C register configuration, equalization, output termination and timing. A related HDMI switch is not automatically a drop-in replacement. No internal alternative is linked because an exact product and package match has not been verified by the catalog API.

The catalog names Analog Devices Inc. ADI's product-selection table explicitly lists AD8190ACPZ in the 56-lead 8 mm by 8 mm exposed-pad LFCSP, and the Rev. 0 datasheet documents the switch architecture and pin functions.

Verify complete marking, LFCSP body, exposed pad and lot traceability. Inspect mounting and thermal connections, then qualify TMDS eye performance, DDC continuity and I2C control behavior in the actual board environment.

Before design or repair, verify the exact ACPZ order code, LFCSP package drawing versus the catalog VFQFN description, exposed-pad layout, TMDS signal integrity, DDC voltage limits, supplies and I2C configuration. The package mapping and production JPG are unresolved; this content must remain under review and must not be published.