Winbond Electronics W66AP6NBQAFJ

Product attributes

Attribute value

Manufacturer:

Winbond Electronics

Series:

-

Package/Case:

200-TFBGA

Packaging:

Tray

Product Status:

Active

Programmable:

-

Memory Type:

Volatile

Memory Format:

DRAM

Technology:

SDRAM - Mobile LPDDR4

Memory Size:

1Gbit

Memory Organization:

64M x 16

Memory Interface:

LVSTL_11

Clock Frequency:

1.6 GHz

Write Cycle Time - Word, Page:

18ns

Access Time:

3.6 ns

Voltage - Supply:

1.06V ~ 1.17V, 1.7V ~ 1.95V

Operating Temperature:

-40°C ~ 105°C (TC)

Grade:

-

Qualification:

-

Mounting Type:

Surface Mount

Supplier Device Package:

200-TFBGA (10x14.5)