JAE Electronics FI-XPB30SRL-HF11

Product attributes

Attribute value

Manufacturer:

JAE Electronics

Series:

FI-XP

Packaging:

Tray

Product Status:

Obsolete

Connector Type:

Receptacle

Contact Type:

Non-Gendered

Style:

Board to Cable/Wire

Number of Positions:

30

Number of Positions Loaded:

All

Pitch - Mating:

0.039" (1.00mm)

Number of Rows:

1

Row Spacing - Mating:

-

Mounting Type:

Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount

Termination:

Solder

Fastening Type:

Friction Lock

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

12.0µin (0.30µm)

Insulation Color:

Black

Insulation Height:

-

Contact Length - Post:

-

Operating Temperature:

-

Material Flammability Rating:

UL94 V-0

Mated Stacking Heights:

-

Ingress Protection:

-

Features:

Grounding Pins, Shielded, Solder Retention

Current Rating (Amps):

-