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Infineon Technologies CYW15G0401DXB-BGI
- Part No.:
- CYW15G0401DXB-BGI
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 256-BGA Exposed Pad
- Datasheet:
-
CYW15G0401DXB-BGI.pdf
- Description:
- IC TELECOM INTERFACE 256BGA
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
CYW15G0401DXB-BGI Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HOTlink II™
- Package/Case:
- 256-BGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Transceiver
- Interface:
- LVTTL
- Number of Circuits:
- 4
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 830mA
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-L2BGA (27x27)
| Image |  |
|
| Part Number | CYW15G0401DXB-BGI | CYW15G0401DXB-BGXC |
| Manufacturer | Infineon Technologies | Infineon Technologies |
| Series | HOTlink II™ | HOTlink II™ |
| Package/Case | 256-BGA Exposed Pad | 256-BGA Exposed Pad |
| Packaging | Tray | Tray |
| Product Status | Obsolete | Obsolete |
| Function | Transceiver | Transceiver |
| Interface | LVTTL | LVTTL |
| Number of Circuits | 4 | 4 |
| Voltage - Supply | 3.135V ~ 3.465V | 3.135V ~ 3.465V |
| Current - Supply | 830mA | 830mA |
| Power (Watts) | - | - |
| Operating Temperature | -40°C ~ 85°C | 0°C ~ 70°C |
| Grade | - | - |
| Qualification | - | - |
| Mounting Type | Surface Mount | Surface Mount |
| Supplier Device Package | 256-L2BGA (27x27) | 256-L2BGA (27x27) |
- Include Parts
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- LMC567CMX/NOPB Texas Instruments 8-SOIC (0.154", 3.90mm Width) IC TELECOM INTERFACE 8SOIC
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