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ROHM Semiconductor BA33BC0FP-E2 is a low-saturation, fixed 3.3 V linear regulator rated for up to 1 A and supplied in a TO-252-3 / DPAK-3 surface-mount package.
Electrical limits, pin assignments, package data, and lifecycle status were checked against ROHM's exact product record and controlled series data sheet.
BA33BC0FP-E2 provides a regulated 3.3 V rail from inputs up to 16 V. Its PNP pass element supports a typical 0.3 V input-to-output differential at 200 mA, while integrated overcurrent protection and thermal shutdown help protect the regulator under overload and excessive-temperature conditions.
The typical 0.3 V differential at 200 mA reduces input headroom compared with standard linear regulators.
Supports logic and embedded rails when junction temperature and package dissipation are kept within limits.
No external feedback divider is required, simplifying the power path and reducing component count.
On-chip overcurrent limiting and thermal shutdown address common overload and overheating faults.
The exact ROHM package is TO252-3, reference code DPAK-3. ROHM lists typical body dimensions of 6.50 mm × 9.50 mm with a 2.50 mm maximum height. The catalog registration is TO-252-3, DPAK (2 Leads + Tab), SC-63.

The registered JPG was verified locally and on the production host as a TO-252 / DPAK three-terminal representation.
ROHM's top-view TO-252-3 pin assignment is:
Do not infer the exposed-fin connection from a generic DPAK drawing; route it as ground for this exact device.
| Output voltage | 3.3 V fixed |
|---|---|
| Recommended input range | 4.3 V to 16 V |
| Absolute maximum supply voltage | 18 V, subject to package dissipation |
| Maximum output current | 1 A |
| Output-voltage accuracy | ±2% at 25°C, IOUT = 200 mA |
| Input-to-output differential | 0.3 V typical, 0.5 V maximum at 200 mA |
| Line regulation | 15 mV typical, 35 mV maximum; VIN = VOUT + 1 V to 16 V, IOUT = 200 mA |
| Load regulation | 35 mV typical, 75 mV maximum; IOUT = 0 mA to 1 A |
| Ripple rejection | 55 dB typical |
| Circuit current | 0.5 mA typical |
| Operating temperature | -40°C to +105°C |
| Output capacitor | 22 µF to 1000 µF |
| Package dissipation | 1.2 W at 25°C on ROHM's specified 70 mm × 70 mm × 1.6 mm board; derate 9.6 mW/°C above 25°C |
Typical values are design references, not guaranteed limits. Apply the test conditions and thermal derating from the ROHM data sheet.
ROHM marks BA33BC0FP-E2 as Last Time Buy and states that product discontinuation has been announced. A substitute must be evaluated for a fixed 3.3 V output, at least 1 A capability, the same TO-252-3 pin and fin functions, input range, dropout, capacitor stability, protection behavior, thermal limits, and qualification requirements.
No unconditional internal substitute is linked because no exact replacement orderable part was verified through both ROHM-controlled replacement information and the product API.
BA33BC0FP-E2 is manufactured by ROHM Semiconductor. The “-E2” orderable suffix identifies tape-and-reel packing; ROHM lists 2,000 devices per reel, RoHS compliance, and moisture-sensitivity level 1 for this product record.
The manufacturer currently classifies this exact orderable part as Last Time Buy.
Fixed 3.3 V rails for microcontrollers and associated logic circuits.
Local point-of-load regulation where the input remains within the specified range.
Board-level conversion from an intermediate rail to 3.3 V.
Post-regulation when linear-regulator dissipation is acceptable.
Verify the complete BA33BC0FP-E2 marking, reel label, lot traceability, package condition, and handling history against purchasing documentation. MSL 1 does not remove the need for normal ESD control, dry packaging inspection, and process qualification.
No. It is the fixed 3.3 V member of the BAxxBC0 family.
No. The three-pin FP version has VCC, N.C., OUT, and a ground fin; it does not include the shutdown control used by some five-pin family members.
Only when input voltage, load, board copper, ambient temperature, airflow, and junction-temperature calculations keep dissipation within the package limit.
ROHM specifies 22 µF to 1000 µF. Capacitor characteristics across bias and temperature must be considered.
Design decisions must follow the current ROHM data sheet and product-change documentation. Recheck lifecycle status before committing a new design, and validate thermal performance, transient behavior, stability, and fault recovery on the intended PCB under worst-case operating conditions.
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