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Laird Technologies EMI 0C97055502
- Part No.:
- 0C97055502
- Manufacturer:
- Laird Technologies EMI
- Package:
- Datasheet:
-
0C97055502.pdf
- Description:
- RFI FINGERSTOCK BECU UNPLAT ADH
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
0C97055502 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Laird Technologies EMI
- Series:
- Twist
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Fingerstock
- Shape:
- -
- Width:
- 0.340" (8.64mm)
- Length:
- 24.000" (609.60mm)
- Height:
- 0.070" (1.78mm)
- Material:
- Beryllium Copper
- Plating:
- Unplated
- Plating - Thickness:
- -
- Attachment Method:
- Adhesive
- Operating Temperature:
- 121°C
| Image |  |
| Part Number | 0C97055502 |
| Manufacturer | Laird Technologies EMI |
| Series | Twist |
| Packaging | Bulk |
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.340" (8.64mm) |
| Length | 24.000" (609.60mm) |
| Height | 0.070" (1.78mm) |
| Material | Beryllium Copper |
| Plating | Unplated |
| Plating - Thickness | - |
| Attachment Method | Adhesive |
| Operating Temperature | 121°C |
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