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Laird Technologies EMI 0077008502
- Part No.:
- 0077008502
- Manufacturer:
- Laird Technologies EMI
- Package:
- Datasheet:
-
0077008502.pdf
- Description:
- RFI FINGERSTOCK BECU ADH
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
0077008502 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Laird Technologies EMI
- Series:
- No Snag
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Fingerstock
- Shape:
- -
- Width:
- 0.600" (15.24mm)
- Length:
- 18.000" (457.20mm)
- Height:
- 0.220" (5.59mm)
- Material:
- Beryllium Copper
- Plating:
- -
- Plating - Thickness:
- -
- Attachment Method:
- Adhesive
- Operating Temperature:
- 121°C
| Image |  |
| Part Number | 0077008502 |
| Manufacturer | Laird Technologies EMI |
| Series | No Snag |
| Packaging | Box |
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.600" (15.24mm) |
| Length | 18.000" (457.20mm) |
| Height | 0.220" (5.59mm) |
| Material | Beryllium Copper |
| Plating | - |
| Plating - Thickness | - |
| Attachment Method | Adhesive |
| Operating Temperature | 121°C |
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