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AMD XCZU7EV-2FFVC1156I

Part No.:
XCZU7EV-2FFVC1156I
Manufacturer:
AMD
Category:
System On Chip (SoC)
Package:
1156-BBGA, FCBGA
Description:
IC SOC CORTEX-A53 1156FCBGA
Quantity:

Unit Price:$0

Ext Price:$0

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XCZU7EV-2FFVC1156I Information

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Product attributes
Attribute value
Manufacturer:
AMD
Series:
Zynq® UltraScale+™ MPSoC EV
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)
Image XCZU7EV-2FFVC1156I XCZU7EV-1FBVB900E XCZU7EV-1FFVC1156E XCZU7EV-1FFVF1517E XCZU7EV-1FBVB900I
Part Number XCZU7EV-2FFVC1156I XCZU7EV-1FBVB900E XCZU7EV-1FFVC1156E XCZU7EV-1FFVF1517E XCZU7EV-1FBVB900I
Manufacturer AMD AMD AMD AMD AMD
Series Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC EV
Package/Case 1156-BBGA, FCBGA 900-BBGA, FCBGA 1156-BBGA, FCBGA 1517-BBGA, FCBGA 900-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Product Status Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Grade - - - - -
Qualification - - - - -
Supplier Device Package 1156-FCBGA (35x35) 900-FCBGA (31x31) 1156-FCBGA (35x35) 1517-FCBGA (40x40) 900-FCBGA (31x31)
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