TMS International Tech(HK) Limited Hello! now TMS International Tech(HK) Limitedtms@lcdchip.com
Follow us :

AMD XC7Z035-1FBG676C

Part No.:
XC7Z035-1FBG676C
Manufacturer:
AMD
Category:
System On Chip (SoC)
Package:
676-BBGA, FCBGA
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
Shipping

XC7Z035-1FBG676C Information

  • Specifications
  • Comparison
  • Tags
Product attributes
Attribute value
Manufacturer:
AMD
Series:
Zynq®-7000
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)
Image XC7Z035-2FFG900I XC7Z035-1FFG676I XC7Z035-1FBG676C XC7Z035-1FBG676I XC7Z035-1FFG676C
Part Number XC7Z035-2FFG900I XC7Z035-1FFG676I XC7Z035-1FBG676C XC7Z035-1FBG676I XC7Z035-1FFG676C
Manufacturer AMD AMD AMD AMD AMD
Series Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
Package/Case 900-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Product Status Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 667MHz 667MHz 667MHz 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Grade - - - - -
Qualification - - - - -
Supplier Device Package 900-FCBGA (31x31) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)
  • XC7Z035-1FBG676C
  • XC7Z035-1FBG676C PDF
  • XC7Z035-1FBG676C Datasheet
  • XC7Z035-1FBG676C Specifications
  • XC7Z035-1FBG676C Images
  • AMD
  • AMD XC7Z035-1FBG676C
  • Buy XC7Z035-1FBG676C
  • XC7Z035-1FBG676C Price
  • XC7Z035-1FBG676C Distributor
  • XC7Z035-1FBG676C Supplier
  • XC7Z035-1FBG676C Wholesale
  • Include Parts
  • Popular Search

The following parts include "XC7Z035-1FBG676C" in Silicon Labs XC7Z035-1FBG676C.

  • Part Number
  • Manufacturer
  • Package
  • Description

Inventory:2,102

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity
Country
Name
Company
Email
Comments

In Stock:2,102

Qty. Unit Price Ext. Price
RFQ now Add to RFQ List
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
TMS International Tech(HK) Limited
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER