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Infineon Technologies TLE9471ESXUMA1

Part No.:
TLE9471ESXUMA1
Manufacturer:
Infineon Technologies
Category:
Specialized ICs
Package:
24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Description:
IC SYST BASIS CHIP TSDSO24-1
Quantity:

Unit Price:$2.43

Ext Price:$2.43

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Product Details

TLE9471ESXUMA1 - OPTIREG Lite Buck CAN System Basis Chip

TLE9471ESXUMA1 from Infineon Technologies is an automotive CAN FD system-basis chip with a 5 V buck regulator, protected auxiliary LDO, watchdog and high-voltage I/O in a 24-lead exposed-pad TSDSO package.

Specifications were checked against the manufacturer data sheet and current distributor listing.

Overview

TLE9471ES integrates a 5 V buck main supply, protected 5 V/100 mA auxiliary supply, high-speed CAN FD transceiver, wake inputs, watchdog, reset and SPI diagnostics.

Design focus: Design the exposed-pad thermal connection, CAN termination, battery protection and mode-control software to the Infineon reference guidance and automotive safety analysis.

Key Advantages

Purpose-built function

Combines an efficient buck MCU supply with CAN FD networking and low-power wake management.

Compact integration

Adds configurable watchdog, reset, fail output and high-voltage GPIO supervision in one automotive-qualified SBC.

Production support

Available in an established surface-mount or through-hole ordering format.

Documented limits

Electrical and environmental limits are defined by the official data sheet.

Feature Summary

Primary function

Automotive CAN FD system basis chip

Interface

CAN FD up to 5 Mbit/s and 16-bit SPI control

Operating range

Automotive supply environment; -40 C to +150 C junction range per data sheet

Package

24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Package & Footprint

This ordering code uses the 24-TSSOP (0.154", 3.90mm Width) Exposed Pad package.

Package-image status: The registry name exists, but the required JPG is missing. Keep this product in review until the image is supplied and visually checked.
24-TSSOP (0.154", 3.90mm Width) Exposed Pad package illustration
24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Pin Functions

CANH / CANL
High-speed CAN bus differential pins
VCC1
5 V, 150 mA main regulator output
VCC2
5 V, 100 mA protected auxiliary regulator output
SDI / SDO / SCLK / CSN
16-bit SPI control and diagnostic interface
WK
High-voltage wake input
FO
Fail-safe output
RESET
Microcontroller reset output
VS / GND / EP
Battery supply, grounds and exposed thermal pad

Confirm exact numbering and the latest land pattern before PCB release.

Key Specifications

FamilyOPTIREG Lite SBC
CAN standardISO 11898-2 high-speed CAN FD
Maximum CAN rate5 Mbit/s
Main regulator5 V buck regulator
Auxiliary regulator5 V, 100 mA protected LDO
Host control16-bit SPI
Wake sourcesCAN, wake pin and cyclic wake
WatchdogConfigurable timeout/window watchdog
QualificationAutomotive AEC-Q100
PackagePG-TSDSO-24-1 exposed pad
Ordering mediumTape and reel, 3000 pieces
Product statusActive and preferred

Replacement Considerations

No exact TLE9471ES alternative was found in the local database. TLE9461ES uses an LDO rather than the same buck supply architecture.

Manufacturer Information

Infineon marks TLE9471ESXUMA1 active and preferred. Validate buck components, EMC, CAN and thermal behavior to the dedicated data sheet.

Applications

Automotive body and cabin controllers

Supplies the MCU efficiently while providing CAN FD and wake supervision.

Transmission and actuator modules

Supports battery-connected modules with low-power states and protected sensor supply.

Quality & Authenticity

Match the complete ordering code, package marking and reel or lot label to authorized-channel records. Inspect moisture handling and solderability requirements before assembly.

FAQ

What is the main function?

Automotive CAN FD system basis chip

What package is used?

24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Is a verified internal replacement available?

No exact internal replacement was verified. Review any candidate against the manufacturer documentation.

Is the package image ready?

No. The registered package JPG is currently missing.

Engineering Notice

Use the latest manufacturer documentation for schematic, PCB, thermal and production approval. Distributor attributes are useful for sourcing but do not replace the official data sheet.

TLE9471ESXUMA1 Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
Lite SBC
Package/Case:
24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Type:
System Basis Chip (SBC)
Applications:
CAN
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSDSO-24-1
Grade:
Automotive
Qualification:
AEC-Q100
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