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Infineon Technologies TLE9461ESV33XUMA1

Part No.:
TLE9461ESV33XUMA1
Manufacturer:
Infineon Technologies
Category:
Specialized ICs
Package:
24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Description:
IC SYST BASIS CHIP TSDSO24-1
Quantity:

Unit Price:$2.24

Ext Price:$2.24

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Product Details

TLE9461ESV33XUMA1 - Automotive Lite System Basis Chip

TLE9461ESV33XUMA1 from Infineon Technologies is an AEC-Q100 automotive system-basis chip with 5 V/100 mA LDO, CAN FD transceiver, high-voltage GPIO, wake inputs and SPI in exposed-pad TSDSO-24.

Specifications were checked against the manufacturer data sheet and current distributor listing.

Overview

TLE9461ES V33 integrates regulated supplies, CAN FD physical-layer communication, wake detection, high-voltage I/O and SPI control for compact automotive ECUs.

Design focus: Verify supply, interface, timing, thermal, EMC, mechanical and qualification requirements against the complete data sheet.

Key Advantages

Purpose-built function

Integrated functions reduce external component count for the intended application.

Compact integration

Manufacturer-defined diagnostics and operating limits support a traceable design review.

Production support

Available in an established surface-mount or through-hole ordering format.

Documented limits

Electrical and environmental limits are defined by the official data sheet.

Feature Summary

Primary function

Automotive Lite System Basis Chip

Interface

Protected automotive input and regulated outputs

Operating range

Use only within the exact limits in the manufacturer data sheet.

Package

24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Package & Footprint

This ordering code uses the 24-TSSOP (0.154", 3.90mm Width) Exposed Pad package.

Package-image status: The registry name exists, but the required JPG is missing. Keep this product in review until the image is supplied and visually checked.
24-TSSOP (0.154", 3.90mm Width) Exposed Pad package illustration
24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Pin Functions

VS / regulators
Protected automotive input and regulated outputs
CANH / CANL
CAN FD bus
SPI
Microcontroller configuration and status
WK / GPIO
Wake inputs and high-voltage I/O
EP / GND
Thermal pad and ground

Confirm exact numbering and the latest land pattern before PCB release.

Key Specifications

Main regulator5 V, 100 mA
CommunicationCAN FD transceiver
Control interfaceSPI
Wake sourcesWake pins and CAN
High-voltage I/OIntegrated GPIO
QualificationAEC-Q100 automotive
PackagePG-TSDSO-24-1 exposed pad
Packing3000-piece tape and reel

Replacement Considerations

Validate all electrical, functional, mechanical and qualification differences before substitution.

Manufacturer Information

Exact manufacturer order code and documentation were checked.

Applications

Automotive body ECUs

Combines power, CAN and wake management around a microcontroller.

Vehicle sensor and actuator nodes

Supports low-power sleep and bus-triggered wake-up.

Quality & Authenticity

Match the complete ordering code, package marking and reel or lot label to authorized-channel records. Inspect moisture handling and solderability requirements before assembly.

FAQ

What is the main function?

Automotive Lite System Basis Chip

What package is used?

24-TSSOP (0.154", 3.90mm Width) Exposed Pad

Is a verified internal replacement available?

No exact internal replacement was verified. Review any candidate against the manufacturer documentation.

Is the package image ready?

No. The registered package JPG is currently missing.

Engineering Notice

Use the latest manufacturer documentation for schematic, PCB, thermal and production approval. Distributor attributes are useful for sourcing but do not replace the official data sheet.

TLE9461ESV33XUMA1 Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
Lite SBC
Package/Case:
24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Type:
System Basis Chip (SBC)
Applications:
CAN
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSDSO-24-1
Grade:
Automotive
Qualification:
AEC-Q100
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