Amphenol ICC (FCI) SIP1X10-001BLF

Product attributes

Attribute value

Manufacturer:

Amphenol ICC (FCI)

Series:

SIP1x

Packaging:

Bulk

Product Status:

Obsolete

Type:

SIP

Number of Positions or Pins (Grid):

10 (1 x 10)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

30.0µin (0.76µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Tin

Contact Finish Thickness - Post:

200.0µin (5.08µm)

Contact Material - Post:

Brass

Housing Material:

Polyphenylene Sulfide (PPS), Glass Filled

Operating Temperature:

-