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Renesas Electronics Corporation R9A06G037GNP#AA0
- Part No.:
- R9A06G037GNP#AA0
- Manufacturer:
- Renesas Electronics Corporation
- Category:
- System On Chip (SoC)
- Package:
- 64-VFQFN Exposed Pad
- Description:
- SOC PLC MODEM LSI SMART GRID ASS
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
R9A06G037GNP#AA0 Information
- Specifications
- Comparison
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- Renesas Electronics Corporation
- Series:
- -
- Package/Case:
- 64-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Architecture:
- DSP, MCU
- Core Processor:
- ARM® Cortex®-M3
- Flash Size:
- -
- RAM Size:
- 128KB
- Peripherals:
- PWM
- Connectivity:
- CSI, I2C, UART
- Speed:
- 138MHz
- Primary Attributes:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 64-HVQFN (9x9)
| Image |  |
| Part Number | R9A06G037GNP#AA0 |
| Manufacturer | Renesas Electronics Corporation |
| Series | - |
| Package/Case | 64-VFQFN Exposed Pad |
| Packaging | Tray |
| Product Status | Active |
| Architecture | DSP, MCU |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | - |
| RAM Size | 128KB |
| Peripherals | PWM |
| Connectivity | CSI, I2C, UART |
| Speed | 138MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Grade | - |
| Qualification | - |
| Supplier Device Package | 64-HVQFN (9x9) |
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