Programmable period
Five OTP-selectable motor output periods: 1, 5, 10, 20 or 30 seconds.
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NXP USA Inc. PCA2002U/AB/1,026
- Part No.:
- PCA2002U/AB/1,026
- Manufacturer:
- NXP USA Inc.
- Category:
- Specialized ICs
- Package:
- Die
- Description:
- IC WATCH CIRCUIT WAFER
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
Product Details
PCA2002U/AB/1,026 - Programmable 32 kHz Watch Motor Driver Die
NXP CMOS watch circuit for a 32.768 kHz quartz crystal and bipolar stepping motor, supplied as an eight-pad wire-bond die in tray.
Technical details and the exact orderable suffix are checked against NXP PCA2002 product data sheet Rev. 9, dated 6 December 2019.
Overview
PCA2002U/AB/1,026 integrates a low-current quartz oscillator, frequency divider, one-time-programmable timing adjustment and bipolar stepping-motor output for battery-operated analog wristwatches. The output period, pulse width and pulse style can be set during production to suit the watch mechanism.
This is a bare wire-bond die, not a WLCSP or molded package. Die attach, bond-wire routing and assembly protection must follow the NXP die outline and handling guidance.
Key Advantages
Motor pulse control
Pulse width and full or 75% chopped drive can be selected, with optional pulse stretching.
Fine time calibration
Programmable digital adjustment supports 1 ppm resolution.
Low current
Typical current between motor pulses is 90 nA under the specified data-sheet test conditions.
Feature Summary
Quartz timebase
Amplitude-regulated 32 kHz oscillator; the quartz crystal is the external timing component.
OTP configuration
Timing correction, output period, motor pulse width, chopping and stretching settings are stored in one-time-programmable memory.
Reset and test
RESET stops the motor for time setting and supports accelerated mechanical testing.
Die delivery
The exact /AB/1,026 orderable version is an eight-bond-pad bare die supplied as chips in tray.
Package & Footprint
NXP identifies PCA2002U/AB/1,026 as a wire-bond die with eight bonding pads. The database package is Die, so a generic molded-package JPG is not applicable. The die top-side marking is PC2002-1.
The NXP data sheet gives 1.16 × 0.86 × 0.22 mm for the die. Use the PCA200xU active-side pad drawing and bond-pad dimensions; do not substitute the PCA2002DUS/DA WLCSP land pattern.
Pin Functions
NXP assigns the following functions to the eight wire-bond pads:
1 VSS
Ground reference.
2 i.c.
Factory-test connection; leave open during normal operation.
3 OSCIN / 4 OSCOUT
Quartz oscillator input and output.
5 VDD
Operating supply and programming interface.
6 MOT1 / 7 MOT2
Bipolar stepping-motor outputs.
8 RESET
Motor stop and test function.
The chip substrate is connected to VSS; NXP states that the die pad must be floating or connected to VSS. Verify bonding orientation from the active-side drawing.
Key Specifications
| Manufacturer | NXP Semiconductors |
|---|---|
| Orderable model | PCA2002U/AB/1,026 |
| Form | Wire-bond die, eight pads, chip in tray |
| Quartz timebase | 32.768 kHz |
| Motor output period | 1, 5, 10, 20 or 30 s; OTP-selectable |
| Motor pulse width | 0.98 to 7.8 ms; programmable |
| Pulse options | Full or 75% chopped; optional stretching pulse |
| Operating supply | 1.1 to 3.6 V at −10 to +60 °C |
| Between-pulse supply current | 90 nA typical at VDD 1.55 V, 25 °C with the reference crystal |
| Calibration resolution | 1 ppm, programmable OTP timing adjustment |
| Die dimensions | 1.16 × 0.86 × 0.22 mm per NXP ordering table |
Typical values are conditional; use the full NXP electrical tables and design margins.
Replacement Considerations
Other PCA200x family members are not unconditional substitutes. PCA2002 has programmable output periods and pulse widths, while PCA2000/PCA2001 use different motor-control functions. Compare die pad positions, OTP programming, motor requirements, delivery form and timing behavior before replacement. No unverified internal substitute link is asserted.
Manufacturer Information
NXP Semiconductors lists PCA2002U/AB/1,026 in the Rev. 9 PCA2002 ordering table as the bare-die, chip-in-tray variant. Check the manufacturer data sheet and handling instructions for the current design release.
Applications
Analog wristwatches
Quartz-timed drive for bipolar stepping motors.
Custom watch modules
Bare-die integration where output period and pulse settings are programmed during assembly.
Quality & Authenticity
Confirm the exact order suffix, active-side marking, tray delivery, die handling history and bond-pad condition against NXP records. This description makes no claim about lot-specific testing or authorized distribution.
FAQ
Is this a molded package?
No. PCA2002U/AB/1,026 is an eight-pad wire-bond die.
Can the motor period be changed?
Yes, via OTP selection among five periods; one-time programming must be planned before production.
Can a WLCSP replace it directly?
No direct assembly interchangeability is implied; bond pads and WLCSP bumps require different processes.
Engineering Notice
Validate crystal, motor load, supply, OTP settings, die attach and bond-wire layout in the completed watch. Observe NXP Rev. 9 electrical ratings, programming procedure, pad connections and bare-die handling requirements. This page does not replace the manufacturer data sheet.
PCA2002U/AB/1,026 Information
- Specifications
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- NXP USA Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Watch Circuit
- Applications:
- Wrist Watches
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
- Grade:
- -
- Qualification:
- -
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