Low-current timing
Typical supply current between motor pulses is 90 nA under the data-sheet reference conditions.
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NXP USA Inc. PCA2001U/AC/1,026
- Part No.:
- PCA2001U/AC/1,026
- Manufacturer:
- NXP USA Inc.
- Category:
- Specialized ICs
- Package:
- Die
- Description:
- IC WATCH CIRCUIT WAFER
- Quantity:
Unit Price:$0
Ext Price:$0
- Payment:
- Shipping:
Product Details
PCA2001U/AC/1,026 - 32 kHz Watch Motor Driver Bare Die
NXP CMOS watch circuit for a 32.768 kHz quartz crystal and a bipolar 1 Hz stepping motor, supplied as an eight-pad wire-bond die.
Based on NXP PCA2000/PCA2001 product data sheet Rev. 9 and the NXP ordering page. Verify the full order suffix and die handling requirements before design release.
Overview
PCA2001U/AC/1,026 is a PCA2001 variant for battery-operated analog wristwatches. It combines a quartz oscillator, frequency divider, one-time-programmable timing adjustment and adaptive bipolar motor drive. The circuit monitors motor steps and increases drive energy when required.
This listing is the wire-bond die option, not an 8-bump WLCSP. Die attach, wire bonding, protection and final assembly are customer design responsibilities.
Key Advantages
Adaptive motor drive
Step detection and programmable pulse modulation help avoid unnecessary motor energy use.
Programmable calibration
OTP timing adjustment supports 1 ppm resolution in the finished watch.
Die integration
Eight bonding pads support integration into a watch module where bare-die assembly is required.
Feature Summary
Quartz timebase
Designed around a 32.768 kHz quartz crystal with a 1 Hz bipolar motor output.
Drive programming
Motor pulse width, lowest and highest duty cycles, and three to six drive stages are configurable in OTP.
Reset and test
RESET supports accurate time setting and accelerated test operation.
Variant function
The PCA2001 does not include the PCA2000 battery end-of-life warning function.
Package & Footprint
NXP lists the PCA2001U/AC/1 type as a wire-bond die with eight bonding pads, delivered as chips in a tray. The database package is Die. A generic molded-package JPG does not apply to this bare-die item.
Use the NXP PCA200xU die outline and bond-pad coordinates, not the PCA200xCX WLCSP land pattern. Nominal die dimensions in Rev. 9 are 1.16 mm × 0.86 mm × 0.20 mm; confirm assembly tolerances from the drawing.
Pin Functions
The NXP eight-pad die pinout is:
1 VSS
Ground reference.
2 i.c.
Internally connected pad; follow NXP connection instructions.
3 OSCIN / 4 OSCOUT
Quartz oscillator input and output.
5 VDD
Supply pad.
6 MOT1 / 7 MOT2
Bipolar stepping-motor outputs.
8 RESET
Reset, stop and test interface.
Bond-pad placement must be taken from the PCA200xU top-view drawing, not a WLCSP pin map.
Key Specifications
| Manufacturer | NXP Semiconductors |
|---|---|
| Orderable model | PCA2001U/AC/1,026 |
| Timebase | 32.768 kHz quartz crystal |
| Motor output | Bipolar stepping motor, nominal 1 Hz |
| Operating supply | 1.1 to 3.6 V, at −10 to +60 °C |
| Supply current | 90 nA typical between motor pulses at VDD 1.55 V, 25 °C and the data-sheet reference crystal |
| Timing adjustment | 1 ppm programmable resolution, OTP |
| Motor pulse width | 0.98 to 7.8 ms, programmable |
| Drive stages | 3 to 6, programmable |
| Bonding pads | 8; wire-bond die |
| Die size | 1.16 × 0.86 × 0.20 mm nominal (NXP Rev. 9) |
| Battery EOL function | does not include the PCA2000 battery end-of-life warning function |
Typical figures are not production guarantees; apply the test conditions and limits in the NXP data sheet.
Replacement Considerations
PCA2001 omits battery end-of-life indication; PCA2000 adds it. A PCA200xCX8 WLCSP option is a different assembly form and is not a direct bare-die substitute. Compare OTP programming, motor requirements, bond-pad layout, delivery form and end-of-life function before any substitution. No unverified internal product link is asserted.
Manufacturer Information
NXP Semiconductors documents the PCA2000/PCA2001 family in product data sheet Rev. 9 and lists the exact PCA2001U/AC/1,026 ordering variant on its product page. The full order suffix should be checked against the intended delivery form.
Applications
Analog wristwatches
Quartz-controlled one-second motor stepping.
Custom watch modules
Bare-die integration where the assembler controls bonding and protection.
Quality & Authenticity
Confirm the exact order code, die marking, tray delivery, handling records and bond-pad condition against NXP documentation. No claim of factory authorization or lot-specific test results is made here.
FAQ
Is this a packaged IC?
No. This listing is the eight-pad wire-bond die variant.
Can a WLCSP replace it directly?
No automatic interchangeability is implied; the WLCSP has a different assembly interface.
What must be programmed?
Timing calibration and motor-drive parameters use OTP settings; follow the NXP programming procedure.
Engineering Notice
Review NXP Rev. 9 electrical limits, die outline, bond-pad coordinates, OTP programming instructions and handling guidance. Verify battery chemistry, motor torque, crystal selection and assembly process in the completed watch. This description does not replace the manufacturer data sheet.
PCA2001U/AC/1,026 Information
- Specifications
- Tags
- Product attributes
- Attribute value
- Manufacturer:
- NXP USA Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Watch Circuit
- Applications:
- Wrist Watches
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
- Grade:
- -
- Qualification:
- -
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