TMS International Tech(HK) Limited Hello! now TMS International Tech(HK) Limitedtms@lcdchip.com
Follow us :

NXP USA Inc. MFS8633BMBA0ES

Part No.:
MFS8633BMBA0ES
Manufacturer:
NXP USA Inc.
Category:
Power Management - Specialized
Package:
48-VFQFN Exposed Pad
Description:
IC FS86 SYSTEM BASIS CHIP ASIL
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
Shipping

MFS8633BMBA0ES Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
NXP USA Inc.
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
Camera
Current - Supply:
-
Voltage - Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN (7x7)
  • MFS8633BMBA0ES
  • MFS8633BMBA0ES PDF
  • MFS8633BMBA0ES Datasheet
  • MFS8633BMBA0ES Specifications
  • MFS8633BMBA0ES Images
  • NXP USA Inc.
  • NXP USA Inc. MFS8633BMBA0ES
  • Buy MFS8633BMBA0ES
  • MFS8633BMBA0ES Price
  • MFS8633BMBA0ES Distributor
  • MFS8633BMBA0ES Supplier
  • MFS8633BMBA0ES Wholesale
  • Include Parts
  • Popular Search

The following parts include "MFS8633BMBA0ES" in Silicon Labs MFS8633BMBA0ES.

  • Part Number
  • Manufacturer
  • Package
  • Description

Inventory:260

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity
Country
Name
Company
Email
Comments

In Stock:260

Qty. Unit Price Ext. Price
1+$3.91$3.91
RFQ now Add to RFQ List
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
TMS International Tech(HK) Limited
TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited TMS International Tech(HK) Limited
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER