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Microchip Technology M2S090-FGG676

Part No.:
M2S090-FGG676
Manufacturer:
Microchip Technology
Category:
System On Chip (SoC)
Package:
676-BGA
Datasheet:
M2S090-FGG676.pdf
Description:
IC SOC CORTEX-M3 166MHZ 676FBGA
Quantity:

Unit Price:$0

Ext Price:$0

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M2S090-FGG676 Information

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Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SmartFusion®2
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Active
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
512KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 90K Logic Modules
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)
Image M2S090T-FCS325I M2S090-FGG484I M2S090TS-1FG484I M2S090TS-1FGG484I M2S090-FGG676
Part Number M2S090T-FCS325I M2S090-FGG484I M2S090TS-1FG484I M2S090TS-1FGG484I M2S090-FGG676
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Series SmartFusion®2 SmartFusion®2 SmartFusion®2 SmartFusion®2 SmartFusion®2
Package/Case 325-TFBGA, FCBGA 484-BGA 484-BGA 484-BGA 676-BGA
Packaging Tray Tray Tray Tray Tray
Product Status Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Flash Size 512KB 512KB 512KB 512KB 512KB
RAM Size 64KB 64KB 64KB 64KB 64KB
Peripherals DDR, PCIe, SERDES DDR, PCIe, SERDES DDR, PCIe, SERDES DDR, PCIe, SERDES DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz 166MHz 166MHz 166MHz 166MHz
Primary Attributes FPGA - 90K Logic Modules FPGA - 90K Logic Modules FPGA - 90K Logic Modules FPGA - 90K Logic Modules FPGA - 90K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Grade - - - - -
Qualification - - - - -
Supplier Device Package 325-FCBGA (11x13.5) 484-FPBGA (23x23) 484-FPBGA (23x23) 484-FPBGA (23x23) 676-FBGA (27x27)
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