Samtec Inc. IC-628-SGG

Product attributes

Attribute value

Manufacturer:

Samtec Inc.

Series:

IC

Packaging:

Bulk

Product Status:

Active

Type:

DIP, 0.6" (15.24mm) Row Spacing

Number of Positions or Pins (Grid):

28 (2 x 14)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

30.0µin (0.76µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Open Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

30.0µin (0.76µm)

Contact Material - Post:

Phosphor Bronze

Housing Material:

Polyester, Glass Filled

Operating Temperature:

-55°C ~ 125°C