Samtec Inc. IC-316-SGT

Product attributes

Attribute value

Manufacturer:

Samtec Inc.

Series:

IC

Packaging:

Bulk

Product Status:

Obsolete

Type:

DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):

16 (2 x 8)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

30.0µin (0.76µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Open Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

10.0µin (0.25µm)

Contact Material - Post:

Phosphor Bronze

Housing Material:

Polyester, Glass Filled

Operating Temperature:

-55°C ~ 125°C