Chip Quik Inc. HDR-SOICN-80

Product attributes

Attribute value

Manufacturer:

Chip Quik Inc.

Series:

-

Packaging:

Bulk

Product Status:

Active

Type:

SOIC

Number of Positions or Pins (Grid):

80 (2 x 40)

Pitch - Mating:

0.050" (1.27mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

39.4µin (1.00µm)

Contact Material - Mating:

-

Mounting Type:

Surface Mount

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.050" (1.27mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

39.4µin (1.00µm)

Contact Material - Post:

-

Housing Material:

Polyamide (PA6T), Nylon 6T, Glass Filled

Operating Temperature:

-40°C ~ 130°C