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Microchip Technology ATECC608B-TNGACTS-B

Part No.:
ATECC608B-TNGACTS-B
Manufacturer:
Microchip Technology
Category:
Specialized ICs
Package:
8-SOIC (0.154", 3.90mm Width)
Description:
IC AUTHENTICATION CHIP 8SOIC
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Unit Price:$0

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Product Details

ATECC608B-TNGACTS-B - Pre-provisioned LoRaWAN Secure Element

ATECC608B-TNGACTS-B from Microchip Technology is a Trust&GO CryptoAuthentication secure element for Actility LoRaWAN development, supplied as a 10-unit bulk prototype order in an 8-lead SOIC package with an I2C host interface.

Electrical, pin and ordering details are based on Microchip's ATECC608B-TNGLoRaWAN controlled data sheet. Verify provisioning and network onboarding before deployment.

Overview

This device is a pre-configured ATECC608B variant designed to protect LoRaWAN credentials and support secure onboarding with the Actility ecosystem. Its key-slot policy and provisioning differ from a blank ATECC608B: select the exact TNGACT ordering code for the intended network workflow. The host MCU communicates over I2C while cryptographic material remains under the secure element's access policy.

Design focus: Confirm Actility onboarding, EUI assignment, slot policy and host software flow against the complete Microchip LoRaWAN data sheet before committing a production design.

Key Advantages

Pre-provisioned security

Trust&GO configuration reduces the need to inject sensitive LoRaWAN keys at the board assembler.

Actility workflow

The TNGACT branch is documented for Actility ThingPark network integration.

Low-power host interface

I2C connection and sleep mode suit battery-powered sensor nodes when the host observes wake and sleep timing.

Prototype ordering

The S-B code identifies the 8-SOIC, 10-unit bulk prototype option; it is not the production reel code.

Feature Summary

LoRaWAN support

Documented for LoRaWAN 1.0 and 1.1, including over-the-air activation workflows.

Credential controls

Protected slots support diversified parent keys, derived session keys, EUI-64 data and reassignment policy.

Cryptography

The data sheet documents a secp256r1 ECC private-key slot and I/O protection key alongside LoRaWAN key storage.

Host connection

I2C interface with a one-time changeable device address; use the prescribed bus and command timing.

Package & Footprint

The registered package is 8-SOIC (0.154", 3.90mm Width). Microchip identifies the S option as an 8-lead SOIC; the B suffix denotes 10-unit bulk prototype ordering. Use the manufacturer land-pattern drawing, not this generic illustration, for final PCB dimensions.

Generic 8-lead SOIC package illustration for ATECC608B-TNGACTS-B
8-SOIC (0.154", 3.90mm Width)
Layout checks
  • Match the pin-1 orientation to the top-view manufacturer drawing.
  • Place I2C pull-ups and decoupling as required by the host bus design.
  • Confirm body, lead pitch and solder footprint against Microchip's package specification.

The local package JPG is present; it is a generic mechanical depiction and does not identify device marking.

Pin Functions

Microchip's 8-lead SOIC top-view pin diagram assigns the following functions:

Pins 1, 2, 3, 7
NC: no internal connection; follow the manufacturer's board guidance.
Pin 4
GND: ground reference.
Pin 5
SDA: I2C serial data.
Pin 6
SCL: I2C serial clock input.
Pin 8
VCC: power supply input.

Pin numbering is top view; verify orientation at schematic and assembly review.

Key Specifications

Exact order codeATECC608B-TNGACTS-B
Device rolePre-provisioned LoRaWAN secure element for Actility
Package8-lead SOIC; registered 8-SOIC (0.154", 3.90mm Width)
Ordering media10-unit bulk prototype option
Host interfaceI2C
Supply voltage2.0 V to 5.5 V recommended operating range
Ambient temperature-40 °C to +85 °C operating range
I2C clock0 to 1 MHz under specified AC conditions
Active current2 mA typical, 3 mA maximum while waiting for I/O or executing non-ECC commands; separate ECC limit applies
ECC execution current14 mA maximum at clock divider 0x0
Idle current800 µA typical under data-sheet pin-level conditions
Sleep current30 nA typical, 150 nA maximum at VCC ≤ 3.6 V and TA ≤ +55 °C under specified pin conditions; 2 µA maximum over full VCC/temperature range
Supported LoRaWAN versions1.0 and 1.1, subject to host/network integration

Typical, maximum and conditional values are identified separately. Consult the manufacturer data sheet for test methods and timing details.

Replacement Considerations

Microchip lists TNGACTS-C and TNGACTS-G as related 8-SOIC Actility options with different production packing. TNGACTU-B uses an 8-UDFN footprint. None should be treated as an unconditional drop-in replacement: verify provisioning state, slot policies, network-provider association, package/footprint, temperature range, electrical limits and ordering media. No unverified internal alternative link is provided.

Manufacturer Information

Microchip Technology identifies this exact S-B order code in the ATECC608B-TNGLoRaWAN product-identification table as the Actility Trust&GO prototype variant. The complete controlled data sheet defines its pinout, electrical operating limits, slot configuration and software integration requirements.

Applications

LoRaWAN sensor nodes

Protects activation credentials and supports secure network joining.

Smart-city endpoints

Adds hardware-backed identity to connected infrastructure nodes.

Actility prototypes

Supports early ThingPark integration and host-software evaluation.

Battery-powered IoT

Pairs with a low-power host that manages the device's active, idle and sleep states.

Quality & Authenticity

Verify the complete TNGACTS-B ordering code, lot traceability, package marking and provisioning records before use. A generic 8-SOIC appearance does not prove the Actility configuration or cryptographic identity of an individual device. Follow Microchip's handling and authentication procedures.

FAQ

What distinguishes the S-B code?

It identifies the Actility Trust&GO LoRaWAN 8-SOIC, 10-unit bulk prototype option.

Is this a blank ATECC608B?

No. It is a pre-configured variant with LoRaWAN-oriented credential and slot policies.

Can a production reel variant replace it automatically?

No. Confirm provisioning, network association, ordering and board-level requirements first.

What host signals are required?

The SOIC pinout uses SDA, SCL, VCC and GND; the remaining four pins are NC.

Engineering Notice

Review the latest Microchip ATECC608B-TNGLoRaWAN data sheet and Actility onboarding instructions before schematic release, firmware integration or production provisioning. Security behavior depends on locked configuration and host commands; family resemblance alone does not establish software or credential compatibility.

ATECC608B-TNGACTS-B Information

  • Specifications
  • Tags
Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
CryptoAuthentication™
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Type:
Authentication Chip
Applications:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Grade:
-
Qualification:
-
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