Laird Technologies EMI 67SLG050050030PI00

Product attributes

Attribute value

Manufacturer:

Laird Technologies EMI

Series:

SMD Grounding Metallized

Packaging:

Tape & Reel (TR)

Product Status:

Active

Type:

Film Over Foam

Shape:

Rectangle

Width:

0.197" (5.00mm)

Length:

0.118" (3.00mm)

Height:

0.197" (5.00mm)

Material:

Polyurethane Foam, Tin-Copper Polyester (SN/CU)

Plating:

-

Plating - Thickness:

-

Attachment Method:

Solder

Operating Temperature:

-40°C ~ 70°C