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Laird Technologies EMI 67B3G3006010010R0C

Part No.:
67B3G3006010010R0C
Manufacturer:
Laird Technologies EMI
Category:
RFI and EMI - Contacts, Fingerstock and Gaskets
Package:
Description:
RFI FINGERSTOCK BECU GOLD SOLDER
Quantity:

Unit Price:$0

Ext Price:$0

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67B3G3006010010R0C Information

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Product attributes
Attribute value
Manufacturer:
Laird Technologies EMI
Series:
B3G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Fingerstock
Shape:
-
Width:
0.119" (3.00mm)
Length:
0.236" (6.00mm)
Height:
0.394" (10.00mm)
Material:
Beryllium Copper
Plating:
Gold
Plating - Thickness:
-
Attachment Method:
Solder
Operating Temperature:
-
Image 67B3G3006010010R0C
Part Number 67B3G3006010010R0C
Manufacturer Laird Technologies EMI
Series B3G
Packaging Tape & Reel (TR)
Product Status Active
Type Fingerstock
Shape -
Width 0.119" (3.00mm)
Length 0.236" (6.00mm)
Height 0.394" (10.00mm)
Material Beryllium Copper
Plating Gold
Plating - Thickness -
Attachment Method Solder
Operating Temperature -
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