Aries Electronics 48-3574-18

Product attributes

Attribute value

Manufacturer:

Aries Electronics

Series:

57

Packaging:

Bulk

Product Status:

Active

Type:

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):

48 (2 x 24)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Tin

Contact Finish Thickness - Mating:

200.0µin (5.08µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Tin

Contact Finish Thickness - Post:

200.0µin (5.08µm)

Contact Material - Post:

Beryllium Copper

Housing Material:

Polyphenylene Sulfide (PPS), Glass Filled

Operating Temperature:

-