Aries Electronics 44-547-11E

Product attributes

Attribute value

Manufacturer:

Aries Electronics

Series:

547

Packaging:

Bulk

Product Status:

Active

Type:

SOIC, ZIF (ZIP)

Number of Positions or Pins (Grid):

44 (2 x 22)

Pitch - Mating:

-

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

20.0µin (0.51µm)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.050" (1.27mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

20.0µin (0.51µm)

Contact Material - Post:

Beryllium Copper

Housing Material:

Polyphenylene Sulfide (PPS), Glass Filled

Operating Temperature:

-