Aries Electronics 28-6554-11

Product attributes

Attribute value

Manufacturer:

Aries Electronics

Series:

55

Packaging:

Bulk

Product Status:

Active

Type:

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

Number of Positions or Pins (Grid):

28 (2 x 14)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

-

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

-

Contact Material - Post:

Beryllium Copper

Housing Material:

Polyphenylene Sulfide (PPS), Glass Filled

Operating Temperature:

-