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3M 214-7390-55-1902

Name: 214-7390-55-1902
Brand: 3M
SKU: 214-7390-55-1902
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 214-7390-55-1902

Manufacturer:: 3M

Category:: IC Sockets

Package:

Description:: CONN SOCKET SOIC 14POS GOLD

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214-7390-55-1902 Information

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Product attributes: Attribute value

Manufacturer:: 3M

Series:: Textool™

Packaging:: Bulk

Product Status:: Active

Type:: SOIC

Number of Positions or Pins (Grid):: 14 (2 x 7)

Pitch - Mating:: -

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: -

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Closed Frame

Termination:: Solder

Pitch - Post:: -

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 30.0µin (0.76µm)

Contact Material - Post:: Beryllium Copper

Housing Material:: Polyethersulfone (PES), Glass Filled

Operating Temperature:: -55°C ~ 150°C

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Part Number	214-3339-00-0602J	214-7390-55-1902	2144-6315-9UA-1902	2141-6321-9UA-1902	2145-6315-9UA-1902
Manufacturer	3M	3M	3M	3M	3M
Series	Textool™	Textool™	Textool™	Textool™	Textool™
Packaging	Tube	Bulk	Bulk	Bulk	Bulk
Product Status	Active	Active	Obsolete	Obsolete	Obsolete
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	SOIC	PGA, ZIF (ZIP)	PGA, ZIF (ZIP)	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	14 (2 x 7)	14 (2 x 7)	144 (15 x 15)	141 (21 x 21)	145 (15 x 15)
Pitch - Mating	0.100" (2.54mm)	-	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)	-	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Connector	Through Hole	Through Hole	Through Hole	Through Hole
Features	Closed Frame	Closed Frame	Closed Frame	Closed Frame	Closed Frame
Termination	Press-Fit	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	-	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Housing Material	Polysulfone (PSU), Glass Filled	Polyethersulfone (PES), Glass Filled	Polyethersulfone (PES)	Polyethersulfone (PES)	Polyethersulfone (PES)
Operating Temperature	-55°C ~ 125°C	-55°C ~ 150°C	-55°C ~ 150°C	-55°C ~ 150°C	-55°C ~ 150°C