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3M 214-3339-00-0602J

Part No.:
214-3339-00-0602J
Manufacturer:
3M
Category:
IC Sockets
Package:
Description:
CONN IC DIP SOCKET ZIF 14POS GLD
Quantity:

Unit Price:$0

Ext Price:$0

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214-3339-00-0602J Information

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Manufacturer:
3M
Series:
Textool™
Packaging:
Tube
Product Status:
Active
Type:
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):
14 (2 x 7)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
30.0µin (0.76µm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Connector
Features:
Closed Frame
Termination:
Press-Fit
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
30.0µin (0.76µm)
Contact Material - Post:
Beryllium Copper
Housing Material:
Polysulfone (PSU), Glass Filled
Operating Temperature:
-55°C ~ 125°C
Image 214-3339-00-0602J 214-7390-55-1902 2144-6315-9UA-1902 2141-6321-9UA-1902 2145-6315-9UA-1902
Part Number 214-3339-00-0602J 214-7390-55-1902 2144-6315-9UA-1902 2141-6321-9UA-1902 2145-6315-9UA-1902
Manufacturer 3M 3M 3M 3M 3M
Series Textool™ Textool™ Textool™ Textool™ Textool™
Packaging Tube Bulk Bulk Bulk Bulk
Product Status Active Active Obsolete Obsolete Obsolete
Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing SOIC PGA, ZIF (ZIP) PGA, ZIF (ZIP) PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) 14 (2 x 7) 14 (2 x 7) 144 (15 x 15) 141 (21 x 21) 145 (15 x 15)
Pitch - Mating 0.100" (2.54mm) - 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) - 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Connector Through Hole Through Hole Through Hole Through Hole
Features Closed Frame Closed Frame Closed Frame Closed Frame Closed Frame
Termination Press-Fit Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) - 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold Gold Gold
Contact Finish Thickness - Post 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Housing Material Polysulfone (PSU), Glass Filled Polyethersulfone (PES), Glass Filled Polyethersulfone (PES) Polyethersulfone (PES) Polyethersulfone (PES)
Operating Temperature -55°C ~ 125°C -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C
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