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Omron Electronics Inc-EMC Div XR2A-2802

Part No.:
XR2A-2802
Manufacturer:
Omron Electronics Inc-EMC Div
Category:
IC Sockets
Package:
Description:
CONN
Quantity:

Unit Price:$0

Ext Price:$0

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XR2A-2802 Information

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Manufacturer:
Omron Electronics Inc-EMC Div
Series:
-
Packaging:
Bulk
Product Status:
Obsolete
Type:
-
Number of Positions or Pins (Grid):
-
Pitch - Mating:
-
Contact Finish - Mating:
-
Contact Finish Thickness - Mating:
-
Contact Material - Mating:
-
Mounting Type:
-
Features:
-
Termination:
-
Pitch - Post:
-
Contact Finish - Post:
-
Contact Finish Thickness - Post:
-
Contact Material - Post:
-
Housing Material:
-
Operating Temperature:
-
Image XR2A-0811-N XR2A-1401-N XR2A-0825 XR2A-1801-N XR2A-0815
Part Number XR2A-0811-N XR2A-1401-N XR2A-0825 XR2A-1801-N XR2A-0815
Manufacturer Omron Electronics Inc-EMC Div Omron Electronics Inc-EMC Div Omron Electronics Inc-EMC Div Omron Electronics Inc-EMC Div Omron Electronics Inc-EMC Div
Series XR2 XR2 XR2 XR2 XR2
Packaging Bulk Bulk Bulk Bulk Bulk
Product Status Active Active Active Active Active
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4) 14 (2 x 7) 8 (2 x 4) 18 (2 x 9) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 29.5µin (0.75µm) Flash 30.0µin (0.76µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
Features Open Frame Open Frame Open Frame Open Frame Open Frame
Termination Solder Solder Solder Solder Solder
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Post Gold Gold Gold Gold Gold
Contact Finish Thickness - Post 10.0µin (0.25µm) 29.5µin (0.75µm) Flash 30.0µin (0.76µm) 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper Beryllium Copper Beryllium Copper Beryllium Copper Brass
Housing Material Polybutylene Terephthalate (PBT), Glass Filled Polybutylene Terephthalate (PBT), Glass Filled Polybutylene Terephthalate (PBT), Glass Filled Polybutylene Terephthalate (PBT), Glass Filled Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C
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