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Omron Electronics Inc-EMC Div XR2A-1401-N

Name: XR2A-1401-N
Brand: Omron Electronics Inc-EMC Div
SKU: XR2A-1401-N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XR2A-1401-N

Manufacturer:: Omron Electronics Inc-EMC Div

Category:: IC Sockets

Package:

Description:: CONN IC DIP SOCKET 14POS GOLD

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XR2A-1401-N Information

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Product attributes: Attribute value

Manufacturer:: Omron Electronics Inc-EMC Div

Series:: XR2

Packaging:: Bulk

Product Status:: Active

Type:: DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid):: 14 (2 x 7)

Pitch - Mating:: 0.100" (2.54mm)

Contact Finish - Mating:: Gold

Contact Finish Thickness - Mating:: 29.5µin (0.75µm)

Contact Material - Mating:: Beryllium Copper

Mounting Type:: Through Hole

Features:: Open Frame

Termination:: Solder

Pitch - Post:: 0.100" (2.54mm)

Contact Finish - Post:: Gold

Contact Finish Thickness - Post:: 29.5µin (0.75µm)

Contact Material - Post:: Beryllium Copper

Housing Material:: Polybutylene Terephthalate (PBT), Glass Filled

Operating Temperature:: -55°C ~ 125°C

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Part Number	XR2A-0811-N	XR2A-1401-N	XR2A-0825	XR2A-1801-N	XR2A-0815
Manufacturer	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div	Omron Electronics Inc-EMC Div
Series	XR2	XR2	XR2	XR2	XR2
Packaging	Bulk	Bulk	Bulk	Bulk	Bulk
Product Status	Active	Active	Active	Active	Active
Type	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)	14 (2 x 7)	8 (2 x 4)	18 (2 x 9)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)	29.5µin (0.75µm)	Flash	30.0µin (0.76µm)	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Open Frame	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Post	Gold	Gold	Gold	Gold	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)	29.5µin (0.75µm)	Flash	30.0µin (0.76µm)	10.0µin (0.25µm)
Contact Material - Post	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C