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Lumissil Microsystems X2000H

Part No.:
X2000H
Manufacturer:
Lumissil Microsystems
Category:
Microprocessors
Package:
270-TFBGA
Datasheet:
X2000H.pdf
Description:
MULTI-CPU HETEROGENEOUS MULTI-AP
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
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X2000H Information

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Manufacturer:
Lumissil Microsystems
Package/Case:
270-TFBGA
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
XBurst® 2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
-
RAM Controllers:
LPDDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, DVP, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (1)
SATA:
-
USB:
USB 2.0 OTG (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
AES, RSA, TRNG, MD5, SHA, SHA2
Mounting Type:
Surface Mount
Supplier Device Package:
270-BGA (12x12)
Additional Interfaces:
DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Image X2000H
Part Number X2000H
Manufacturer Lumissil Microsystems
Package/Case 270-TFBGA
Series -
Packaging Tape & Reel (TR)
Product Status Active
Core Processor XBurst® 2
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 1.2GHz
Co-Processors/DSP -
RAM Controllers LPDDR3
Graphics Acceleration No
Display & Interface Controllers LCD, DVP, MIPI-CSI, MIPI-DSI
Ethernet 10/100/1000Mbps (1)
SATA -
USB USB 2.0 OTG (1)
Voltage - I/O 1.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Security Features AES, RSA, TRNG, MD5, SHA, SHA2
Mounting Type Surface Mount
Supplier Device Package 270-BGA (12x12)
Additional Interfaces DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
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